Adhesion promotion of thick polyphosphate-poly(allylamine) films onto polyolefin substrates by plasma polymers

Plasma polymer films typically consist of very short fragments of the precursor molecules. That rather limits the applicability of most plasma polymerisation/plasma-enhanced chemical vapour deposition (PECVD) processes in cases where retention of longer molecular structures is desirable. Plasma-assisted vapour thermal deposition (PAVTD) circumvents this limitation by using a classical bulk polymer as a high molecular weight “precursor”. As a model polymer in this study, polylactic acid (PLA) has been used. The resulting PLA-like films were characterised mostly by X-ray photoelectron spectroscopy (XPS) and nuclear magnetic resonance (NMR) spectroscopy. The molecular structure of the films was found to be tunable in a broad range: from the structures very similar to bulk PLA polymer to structures that are more typical for films prepared using PECVD. In all cases, PLA-like groups are at least partially preserved. A simplified model of the PAVTD process chemistry was proposed and found to describe well the observed composition of the films. The structure of the PLA-like films demonstrates the ability of plasma-assisted vapour thermal deposition to bridge the typical gap between the classical and plasma polymers.

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Rational approaches for optimizing chemical functionality of plasma polymers: A case study with ethyl trimethylacetate

Plasma Processes and Polymers ◽

10.1002/ppap.202000195 ◽

2020 ◽

Author(s):

Solmaz Saboohi ◽

Bryan R. Coad ◽

Robert D. Short ◽

Andrew Michelmore ◽

Hans J. Griesser

Keyword(s):

Plasma Polymers ◽

Chemical Functionality

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Novel adhesion promotion of aluminium for aerospace environments

Surface Engineering and Applied Electrochemistry ◽

10.3103/s1068375516060132 ◽

2016 ◽

Vol 52 (6) ◽

pp. 515-519 ◽

Cited By ~ 3

Author(s):

H. Prakash ◽

S. Bhowmik ◽

G. Ajeesh ◽

M. Thenarasu

Keyword(s):

Adhesion Promotion

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Surface Modification of Conventional Polymers by Depositing Plasma Polymers of Trimethylsilane and of Trimethylsilane + O2

Journal of Colloid and Interface Science ◽

10.1006/jcis.1998.5963 ◽

1999 ◽

Vol 211 (1) ◽

pp. 18-27 ◽

Cited By ~ 32

Author(s):

Christopher M. Weikart ◽

Masayo Miyama ◽

Hirotsugu K. Yasuda

Keyword(s):

Surface Modification ◽

Plasma Polymers

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The Study of Fluorinated Amorphous Carbon as Low-K Dielectric Material and its Interface with Copper Metallization

MRS Proceedings ◽

10.1557/proc-565-203 ◽

1999 ◽

Vol 565 ◽

Cited By ~ 1

Author(s):

N. Ariel ◽

M. Eizenberg ◽

E. Y. Tzou

Keyword(s):

Amorphous Carbon ◽

Nuclear Reactions ◽

Dielectric Material ◽

Copper Metallization ◽

Limiting Factor ◽

Adhesion Promoter ◽

Adhesion Promotion ◽

High Resolution Tem ◽

Rc Delay ◽

Low K

AbstractIn order to achieve better performance of devices, the interconnects RC delay time, the limiting factor of the device speed today, must be reduced. This calls for a new interconnect stack: lower resistivity Copper and low k materials (k<3) as dielectrics.Fluorinated amorphous carbon (a-F:C) prepared by HDP- CVD is an attractive candidate as a low-k material. In this work we have studied the film, its stability and its interface with Copper metallization. The high density plasma CVD process resulted in a film which contains C and F at a ratio of 1:0.6 as determined by Nuclear Reactions Analysis. XPS analysis of the Cls transition indicated four types of bonds: C-C, C-CF, CF, and CF2. X-ray diffraction as well as high resolution TEM analyses proved that the film was amorphous at least up to 500°C anneal. For various applications, the advantage of adding a thin bi-layer of a-SiC/SiOx for adhesion promotion purposes was demonstrated. In addition, the interface of a-F:C and the adhesion promoter layer with Ta, TaN and Cu was studied. No interdiffusion was observed by SIMS after 400°C annealing. 500°C annealing caused F outdiffusion from the film and Cu diffusion into the adhesion promoter layer.

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