Evaluation of three nondestructive testing techniques for quality assessment of asphalt pavements

2018 ◽  
Vol 33 (4) ◽  
pp. 361-375 ◽  
Author(s):  
Shibin Lin ◽  
Jeramy Ashlock ◽  
R. Christopher Williams ◽  
Hosin David Lee ◽  
Yujin Wang
Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


This paper provides a general note on the state of the art in the application of nondestructive testing techniques (NDT) for the detection of defects or deteriorations in metallic and nonmetallic oil and gas pipes. The advantages and disadvantages of each technique will be pointed out.


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