Finite element simulation of self-heated pavement under different mechanical and thermal loading conditions

2018 ◽  
Vol 20 (8) ◽  
pp. 1807-1826
Author(s):  
Xin He ◽  
Sherif Abdelaziz ◽  
Fangliang Chen ◽  
Huiming Yin
2007 ◽  
Vol 339 ◽  
pp. 276-280
Author(s):  
Y.T. Yu ◽  
Wei Zheng Yuan ◽  
D.Y. Qiao

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.


2006 ◽  
Vol 79 (5) ◽  
pp. 835-858 ◽  
Author(s):  
G. Marckmann ◽  
E. Verron

Abstract The present paper proposes a thorough comparison of twenty hyperelastic models for rubber-like materials. The ability of these models to reproduce different types of loading conditions is analyzed thanks to two classical sets of experimental data. Both material parameters and the stretch range of validity of each model are determined by an efficient fitting procedure. Then, a ranking of these twenty models is established, highlighting new efficient constitutive equations that could advantageously replace well-known models, which are widely used by engineers for finite element simulation of rubber parts.


2020 ◽  
Vol 33 (1) ◽  
pp. 27-33
Author(s):  
Sathish Kumar ◽  
Oleg R. Kuzichkin ◽  
Ahmed Faisal Siddiqi ◽  
Inna Pustokhina ◽  
Aleksandr Yu Krasnopevtsev

Purpose This study aims to investigate simultaneous power and thermal loading. Design/methodology/approach Finite element method simulations coupled with experiments. Findings The effects of power cycling have been determined. Originality/value This paper aims to testify the combined effects of thermal and power cycling loads on the reliability of solder ball joints with barrel- and hourglass-type geometries in an electronic system. The finite element simulation outcomes showed that the maximum strain energy was accumulated at the edges of barrel-type solder, whereas the hourglass-type was vulnerable at the necking side. It was also found that the hourglass-type solder showed a reliable behavior when the sole thermal cycling was exerted to the electronic system, whereas the barrel-type solder was a better choice under simultaneous application of thermal and power loadings. The experimental results also confirmed the finite element simulation and indicated that the solder joint reliability strongly depends on the geometry of interconnection in different operating conditions. An extensive discussion was presented to shed light on the paramount importance of combined thermal/power cycling on the reliability of solder joints.


2017 ◽  
Vol 24 (4) ◽  
pp. 609-620 ◽  
Author(s):  
Shahryar Alikarami ◽  
Ali Parvizi

AbstractAn exact analytical elasto-plastic solution for thick-walled cylinder made of functionally graded materials (FGMs) subjected to combined pressure and thermal loading is presented in this paper. It is assumed that the cylinder is bonded at both ends, the material is radially graded and complies with the elastic perfectly plastic behavior. The relations in determining the plastic zone radius as well as the radial, circumferential, longitudinal and effective stresses in both elastic and plastic zones are obtained for any combined loading condition. Moreover, using ABAQUS/Explicit software, the functionally graded (FG) cylinder is simulated in every respect. Comparison of the present theoretical results with those from a finite element simulation illustrates the accuracy of the present analysis.


2022 ◽  
Vol 42 (1) ◽  
pp. 141-155
Author(s):  
abdelrahman yasser ◽  
Fayek hassona ◽  
Beshoy Hakeem ◽  
Ahmed Moussa Abu Bakr

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