Thermal conductivity variation and heat generation effects on magneto-hybrid nanofluid flow in a porous medium with slip condition

2020 ◽  
pp. 1-25 ◽  
Author(s):  
Mohamed R. Eid ◽  
Mohamed A. Nafe
Keyword(s):  
Thermal Conductivity ◽  
Porous Medium ◽  
Heat Generation ◽  
Slip Condition ◽  
Hybrid Nanofluid ◽  
Nanofluid Flow ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Thermal Conductivity ◽  
Numerical Simulation ◽  
Experimental Investigation ◽  
Thermal Process ◽  
Light Wave ◽  
Light Reflection ◽  
Lead Wire ◽  
Wire Surface ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.

Multi-scale numerical prediction of flow-induced thermal conductivity variation in micro-injection molded heat sink

2016 ◽  
Vol 24 (3) ◽  
pp. 566-573
Author(s):  
杨灿 YANG Can ◽  
曹泽卫 CAO Ze-wei ◽  
尹晓红 YIN Xiao-hong ◽  
阚君武 KAN Jun-wu ◽  
程光明 CHENG Guang-ming ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Numerical Prediction ◽  
Multi Scale ◽  
Conductivity Variation ◽  
Injection Molded ◽  
Thermal Conductivity Variation

The measurement of thermal conductivity variation with temperature for Sn-20wt.% In based lead-free ternary solders

2013 ◽  
Vol 554 ◽  
pp. 63-70 ◽  
Author(s):  
Esra Öztürk ◽  
Sezen Aksöz ◽  
Kazım Keşlioğlu ◽  
Necmettin Maraşlı
Keyword(s):  
Thermal Conductivity ◽  
Lead Free ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation
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