Investigation of temperature-dependent performances of InP/In0.53Ga0.34Al0.13As heterojunction bipolar transistors

2000 ◽  
Vol 15 (12) ◽  
pp. 1101-1106 ◽  
Author(s):  
Hsi-Jen Pan ◽  
Wei-Chou Wang ◽  
Kong-Beng Thei ◽  
Chin-Chuan Cheng ◽  
Kuo-Hui Yu ◽  
...  
2009 ◽  
Vol 56 (10) ◽  
pp. 2169-2177 ◽  
Author(s):  
Lan Luo ◽  
Guofu Niu ◽  
Kurt A. Moen ◽  
John D. Cressler

In this paper, we investigate the physics and modeling of temperature dependence of various parasitic resistances in SiGe heterojunction bipolar transistors down to 30 K. Carrier freezeout is shown to be the dominant contributor to increased resistances at cryogenic temperatures for lightly-doped and moderately-doped regions, whereas the temperature dependence of the mobility is the dominant contributor to the temperature dependence of heavily-doped regions. Two incomplete ionization models, the classic model with a doping dependent activation energy and the recent model of Altermatt , are shown to underestimate and overestimate incomplete ionization rate below 100 K for intrinsic base doping, respectively. Analysis of experimental data shows that the bound state fraction factor is temperature dependent and including this temperature dependence enables compact modeling of resistances from 30 to 300 K for moderately-doped regions. For heavily-doped regions, a dual power law mobility approximation with complete ionization is shown to work well down to 30 K. An alternative approach is also presented for heavily-doped resistors which allows one to use the same model equation for all regions.


Electronics ◽  
2020 ◽  
Vol 9 (9) ◽  
pp. 1365
Author(s):  
Aakashdeep Gupta ◽  
K Nidhin ◽  
Suresh Balanethiram ◽  
Shon Yadav ◽  
Anjan Chakravorty ◽  
...  

In this paper, we extend the model developed in part-I of this work to include the effects of the back-end-of-line (BEOL) metal layers and test its validity against on-wafer measurement results of SiGe heterojunction bipolar transistors (HBTs). First we modify the position dependent substrate temperature model of part-I by introducing a parameter to account for the upward heat flow through BEOL. Accordingly the coupling coefficient models for bipolar transistors with and without trench isolations are updated. The resulting modeling approach takes as inputs the dimensions of emitter fingers, shallow and deep trench isolation, their relative locations and the temperature dependent material thermal conductivity. Coupling coefficients obtained from the model are first validated against 3D TCAD simulations including the effect of BEOL followed by validation against measured data obtained from state-of-art multifinger SiGe HBTs of different emitter geometries.


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