Effects of microstructural inhomogeneity on dynamic grain growth during large-strain grain boundary diffusion-assisted plastic deformation

2005 ◽  
Vol 13 (7) ◽  
pp. 1129-1151 ◽  
Author(s):  
R Ding ◽  
D Moldovan ◽  
V Yamakov ◽  
D Wolf ◽  
S R Phillpot
1999 ◽  
Vol 47 (12) ◽  
pp. 3433-3439 ◽  
Author(s):  
Byung-Nam Kim ◽  
Keijiro Hiraga ◽  
Yoshio Sakka ◽  
Byung-Wook Ahn

2011 ◽  
Vol 312-315 ◽  
pp. 1116-1125
Author(s):  
Vladimir V. Popov

Recent models of grain-boundary diffusion are briefly reviewed. Models of diffusion along equilibrium boundaries of recrystallization origin in coarse-grained materials and along non-equilibrium boundaries in nanocrystalline materials obtained by gas condensation and compacting or by severe plastic deformation are considered separately.


1999 ◽  
Vol 601 ◽  
Author(s):  
B.-N. Kim ◽  
K. Hiraga

AbstractSuperplastic tensile deformation is simulated in 2 dimensions by incorporating grain boundary diffusion and concurrent grain growth derived from static and dynamic growth mechanisms. The following relationship is found between microstructural changes and deformation behavior for constant stress conditions. Grain boundary diffusion produces an increase in the aspect ratio of the matrix grains during deformation and the increased aspect ratio causes a change in creep rate parameters: the stress exponent is decreased from the initial value of 1.0 for equiaxed grains and the grain size exponent is increased from the initial value of 3.0. Accelerated grain growth is also found by the present simulation.


2007 ◽  
Vol 266 ◽  
pp. 13-28 ◽  
Author(s):  
Alan F. Jankowski

Thermal anneal treatments are used to identify the temperature range of the two dominant diffusion mechanisms – bulk and grain boundary. To assess the transition between mechanisms, the low temperature range for bulk diffusion is established utilizing the decay of static concentration waves in composition-modulated nanolaminates. These multilayered structures are synthesized using vapor deposition methods as thermal evaporation and magnetron sputtering. However, at low temperature the kinetics of grain-boundary diffusion are much faster than bulk diffusion. The synthesis of Au-Cu alloys (0-20 wt.% Cu) with grain sizes as small as 5 nm is accomplished using pulsed electro-deposition. Since the nanocrystalline grain structure is thermally unstable, these structures are ideal for measuring the kinetics of grain boundary diffusion as measured by coarsening of grain size with low temperature anneal treatments. A transition in the dominant mechanism for grain growth from grain boundary to bulk diffusion is found with an increase in temperature. The activation energy for bulk diffusion is found to be 1.8 eV·atom-1 whereas that for grain growth at low temperatures is only 0.2 eV·atom-1. The temperature for transitioning from the dominant mechanism of grain boundary to bulk diffusion is found to be 57% of the alloy melt temperature and is dependent on composition.


2016 ◽  
Vol 367 ◽  
pp. 130-139 ◽  
Author(s):  
Vladimir V. Popov ◽  
A.V. Sergeev

The grain-boundary diffusion of Co in ultra-fine grained Mo processed by high-pressure torsion has been studied by emission Mössbauer spectroscopy and radio-tracer analysis. It is demonstrated that under the severe plastic deformation by high-pressure torsion the non-equilibrium grain boundaries are formed which are the ultra-fast diffusion paths. At annealing in the temperature range of 623-823 K the relaxation of the non-equilibrium boundaries proceeds and their properties approach to those of equilibrium boundaries of recrystallization origin.


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