Thermal Performance Study of VPS-W Coatings on CuCrZr Under High Heat Flux

2007 ◽  
Vol 9 (3) ◽  
pp. 261-264 ◽  
Author(s):  
Chong Fali ◽  
Chen Junling ◽  
Li Jiangang ◽  
Zheng Xuebin ◽  
Ding Chuanxian
Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1929 ◽  
Author(s):  
M. Sarafraz ◽  
Mohammad Safaei ◽  
Zhe Tian ◽  
Marjan Goodarzi ◽  
Enio Bandarra Filho ◽  
...  

In the present study, we report the results of the experiments conducted on the convective heat transfer of graphene nano-platelets dispersed in water-ethylene glycol. The graphene nano-suspension was employed as a coolant inside a micro-channel and heat-transfer coefficient (HTC) and pressure drop (PD) values of the system were reported at different operating conditions. The results demonstrated that the use of graphene nano-platelets can potentially augment the thermal conductivity of the working fluid by 32.1% (at wt. % = 0.3 at 60 °C). Likewise, GNP nano-suspension promoted the Brownian motion and thermophoresis effect, such that for the tests conducted within the mass fractions of 0.1%–0.3%, the HTC of the system was improved. However, a trade-off was identified between the PD value and the HTC. By assessing the thermal performance evaluation criteria (TPEC) of the system, it was identified that the thermal performance of the system increased by 21% despite a 12.1% augmentation in the PD value. Furthermore, with an increment in the fluid flow and heat-flux applied to the micro-channel, the HTC was augmented, showing the potential of the nano-suspension to be utilized in high heat-flux thermal applications.


2020 ◽  
Vol 2020 ◽  
pp. 1-10
Author(s):  
Shuangshuang Miao ◽  
Jiajia Sui ◽  
Yulong Zhang ◽  
Feng Yao ◽  
Xiangdong Liu

Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components. The copper-water bent heat pipes are particularly suited to the circumstances of confined space or misplaced heat and cold sources for high-heat-flux electronic components. In this paper, the steady and transient thermal performance of a bent copper-water heat pipe is studied based on a performance test system. The effects of cooling temperature, working conditions on the critical heat flux, and equivalent thermal conductivity have been examined and analyzed. Moreover, the influences of heat input and working conditions on the thermal response of a bent heat pipe have also been discussed. The results indicate that the critical heat flux is enhanced due to the increases in cooling temperature and the lengths of the evaporator and condenser. In addition, the critical heat flux is improved by extending the cooling length only when the operating temperature is higher than 50°C. The improvement on the equivalent thermal by increasing the heating length is more evident than that by increasing cooling length. It is also demonstrated by the experiment that the bent copper-water heat pipe can respond quickly to the variation of heat input and possesses superior transient heat transfer performance.


2001 ◽  
Vol 56-57 ◽  
pp. 205-210 ◽  
Author(s):  
Y Kubota ◽  
N Noda ◽  
A Sagara ◽  
R Sakamoto ◽  
K Yamazaki ◽  
...  

Author(s):  
Martin Smalc ◽  
Prathib Skandakumaran ◽  
Julian Norley

Natural graphite heat spreaders are in use in electronic cooling applications where heat flux density is low. Natural graphite is an anisotropic material, with a high thermal conductivity in the plane of the spreader combined with a much lower thermal conductivity through its thickness. This low through-thickness thermal conductivity poses a problem when attempting to cool heat sources with relatively high heat flux densities. This problem can be overcome by embedding a thermal via in the graphite material. This via is made from an isotropic material with a thermal conductivity significantly higher than the through-thickness graphite conductivity. This paper examines the thermal performance of a natural graphite heat spreader with an embedded thermal via. The work is primarily experimental although numerical models were used to guide the experiments. The thermal performance of these spreaders is compared to that of spreaders made from conventional isotropic materials. The effect of accelerated aging tests on the performance of these graphite spreaders is reviewed. Finally, two applications are examined; first cooling an ASIC module and second, cooling an FB-DIMM memory card.


2002 ◽  
Vol 4 (4) ◽  
pp. 1387-1394 ◽  
Author(s):  
Chen Jun-ling ◽  
Li Jian-gang ◽  
N Noda ◽  
Y Kubota ◽  
Guo Quan-gui ◽  
...  

Author(s):  
M. J. Rhodes ◽  
M. R. Taylor ◽  
J. G. Monroe ◽  
S. M. Thompson

The thermal performance of a flat-plate oscillating heat pipe (FP-OHP) - with modified evaporator and condenser was experimentally investigated during high heat flux conditions. The copper FP-OHP (101.6 × 101.6 × 3.18 mm3) possessed two inter-connected layers of 1.02 mm2 square channels with the evaporator and condenser possessing two parallel, 0.25 × 0.51 mm2 square microchannels. The microchannels were integrated to enhance evaporation and condensation heat transfer to improve the FP-OHP’s ability to transport high heat flux. The FP-OHP was oriented vertically and locally heated with a 14.52 cm2 heating block at its base and cooled with a water block that provided either: 20 °C, 40 °C, or 60 °C operating temperatures. A FP-OHP without embedded microchannels was also investigated for baseline performance comparison. Both FP-OHPs were filled with Novec HFE-7200 (3M) working fluid at a filling ratio of approximately 80% by volume. The maximum temperature of each FP-OHP was recorded versus time for various heat inputs for the investigated operating temperatures. The results indicate that the integrated microchannels enhance the FP-OHP’s thermal performance for all operating temperatures. At 20 °C, 40 °C, and 60 °C, the microchannel-embedded evaporator and condenser dissipated 80 W, 65 W, and 55 W more than the baseline control with a minimum thermal resistance of 0.219 °C/W, 0.205 °C/W, and 0.170 °C/W, respectively — corresponding to a percent enhancement on-the-order of 25%. This percent enhancement increased with operating temperature. It has also been shown that Novec HFE-7200 allows the FP-OHP to start at relatively lower heat inputs — as low as 35 W, demonstrating that this working fluid can enhance heat transfer even at lower heat flux applications.


2011 ◽  
Vol 133 (5) ◽  
Author(s):  
Liang Gong ◽  
Krishna Kota ◽  
Wenquan Tao ◽  
Yogendra Joshi

Wavy channels were investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in microsized wavy channels was performed by varying the wavy feature amplitude, wavelength, and aspect ratio for different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs directly face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.


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