An error similarity-based error-compensation method for measurement in the nonuniform temperature field

2020 ◽  
Vol 31 (8) ◽  
pp. 085008
Author(s):  
Qi Zeng ◽  
Shuanggao Li ◽  
Zhengping Deng ◽  
Xiang Huang
Keyword(s):  
Temperature Field ◽  
Error Compensation ◽  
Compensation Method ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field

Hot forming with a nonuniform temperature field using die partition cooling

2019 ◽  
Vol 116 (6) ◽  
pp. 613
Author(s):  
Cai-yi Liu ◽  
Yan Peng ◽  
Ling Kong ◽  
Lu-han Hao ◽  
Ren Zhai
Keyword(s):  
Temperature Field ◽  
Material Properties ◽  
High Strength ◽  
Strengthening Mechanism ◽  
Hot Forming ◽  
Nonuniform Temperature ◽  
Forming Process ◽  
Gradient Distribution ◽  
Forming Technology ◽  
Nonuniform Temperature Field

High strength steel hot forming technology plays an important role in achieving lightweight vehicles, improving the safety of vehicles. The tensile strength of the blank formed by traditional hot forming process is as high as 1500–2000 MPa, the strength of the formed blank is high, but the elongation is usually low and comprehensive mechanical property is not high. In this article, the process control of material gradient properties hot forming technology is summarized through the analysis of strengthening mechanism of gradient distribution hot forming technology. Based on the traditional hot forming technology, a new hot forming technology based on partition cooling to achieve material property gradient distribution is proposed. By changing the cooling rate of blank in different zones is different, and the gradient distribution of material properties is finally obtained. The DEFORM is used to analyze the hot forming process of the blank under the nonuniform temperature field of the partition cooling. A set of partition cooling hot forming die was designed independently to verify the experimental results. The evolution mechanism of microstructure and its effect on material properties during hot forming under nonuniform temperature field with partition cooling were revealed.

Image distortion correction method in a nonuniform temperature field by using Runge–Kutta ray tracing

2019 ◽  
Vol 36 (10) ◽  
pp. 1795
Author(s):  
Jun Wu ◽  
Xin Li ◽  
Haitao Xu ◽  
Jun Xu ◽  
Zhijing Yu
Keyword(s):  
Temperature Field ◽  
Ray Tracing ◽  
Correction Method ◽  
Image Distortion ◽  
Distortion Correction ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field ◽  
Runge Kutta

Effect of a nonuniform temperature field on the distribution of the residual stresses with frontal hardening

1980 ◽  
Vol 16 (3) ◽  
pp. 368-372 ◽  
Author(s):  
L. V. Klychnikov ◽  
S. P. Davtyan ◽  
S. I. Khudyaev ◽  
N. S. Enikolopyan
Keyword(s):  
Temperature Field ◽  
Residual Stresses ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field ◽  
Frontal Hardening

The energy equation of a sphere in an unsteady and nonuniform temperature field

1996 ◽  
Vol 35 (409) ◽  
pp. 4 ◽  
Author(s):  
par Z.-G. Feng ◽  
E.E. Michaelides ◽  
M.-F. Scibilia
Keyword(s):  
Temperature Field ◽  
Energy Equation ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field

scholarly journals Термополяризационный эффект в линейном полиэтиленоксиде при кристаллизации из расплава

2018 ◽  
Vol 60 (10) ◽  
pp. 1911
Author(s):  
Н.Н. Матвеев ◽  
Н.И. Борисова ◽  
Н.С. Камалова ◽  
Н.Ю. Евсикова
Keyword(s):  
Molecular Weight ◽  
Temperature Field ◽  
Polyethylene Oxide ◽  
Crystallization Temperature ◽  
Structural Changes ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field

AbstractThe correlation between crystallite structural changes and polarization properties of a linear crystallized [–CH_2CH_2O–]_ n polyethylene oxide polymer is studied. The average spherulite radius and polarization of polyethylene oxide are inspected as functions of molecular weight of polymer and crystallization temperature from melt in a nonuniform temperature field.

Shallow Prismatic Shell in a Nonuniform Temperature Field

2005 ◽  
Vol 41 (2) ◽  
pp. 170-177
Author(s):  
B. S. Khapko
Keyword(s):  
Temperature Field ◽  
Nonuniform Temperature ◽  
Nonuniform Temperature Field ◽  
Prismatic Shell

Wave-Front Stress Relaxation in a One-Dimensional Nonlinear Inelastic Material With Temperature and Position Dependent Properties

1971 ◽  
Vol 38 (1) ◽  
pp. 47-50 ◽  
Author(s):  
R. P. Shaw ◽  
F. A. Cozzarelli
Keyword(s):  
Temperature Field ◽  
Wave Front ◽  
Material Properties ◽  
Plastic Material ◽  
Nonuniform Temperature ◽  
Temperature Dependent ◽  
One Dimensional ◽  
Nonuniform Temperature Field ◽  
Nonlinear Viscoelastic ◽  
Inelastic Material

Analytical solutions are obtained for stress, velocity, and strain at the wave front in a suddenly loaded semi-infinite rod of a material with a linear instantaneous response and nonlinear inelastic response. The material properties are assumed to depend on position directly or through a dependence on a prescribed nonuniform temperature field. Detailed solutions are obtained for two examples—a nonlinear viscoelastic material with temperature dependent parameters and a rate-sensitive plastic material which may have temperature dependent parameters and yield point.

Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects

1998 ◽  
Vol 516 ◽  
Author(s):  
Y. -L. Shen
Keyword(s):  
Temperature Field ◽  
Heat Conduction ◽  
Silicon Dioxide ◽  
Joule Heating ◽  
Thermal Stresses ◽  
Nonuniform Temperature ◽  
Microelectronic Devices ◽  
Nonuniform Temperature Field ◽  
Substantial Temperature ◽  
Current Densities

AbstractThe effects of metal Joule heating in interconnects were studied numerically. Particular attention is devoted to the multilevel nature of interconnects in modem microelectronic devices. Heat conduction analyses were carried out to quantify the temperature rise in structures composed of various levels of metal lines under different electric current densities. Two types of metallization (aluminum and copper) and two types of interlevel dielectric (silicon dioxide and polyimide) were considered. It was found that increasing the total number of metal level and/or switching the dielectric from silicon dioxide to polymer-based low-k dielectrics can cause substantial temperature increases, pointing out that interconnect Joule heating can become a major reliability threat in future applications. Thermal stresses induced by the nonuniform temperature field were also analyzed.

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