Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

2020 ◽  
Vol 35 (9) ◽  
pp. 095010
Author(s):  
Longxu Yao ◽  
Lei Zhang ◽  
Qianqing Jiang ◽  
Chunfeng Yang
Keyword(s):  
Single Crystal ◽  
Chip Thickness ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Undeformed Chip Thickness ◽  
Brittle Transition ◽  
Ductile Mode

Study on Influence Laws of Surface Roughness of Micro-Groove in Single Crystal Silicon under Diamond Fly-Cutting

2015 ◽  
Vol 667 ◽  
pp. 142-148 ◽  
Author(s):  
Yan Yan Yan ◽  
Run Xing Wang ◽  
Bo Zhao
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Chip Thickness ◽  
Single Crystal Silicon ◽  
Spindle Speed ◽  
Cutting Depth ◽  
Crystal Silicon ◽  
Groove Surface ◽  
Undeformed Chip Thickness ◽  
Fly Cutting

Single crystal silicon has both important application value in the fields of micro-optics and MEMS, and it has been considered as one of the most difficult-to-cut materials because of its hardness and brittleness. Removal mechanism of the silicon was discussed, and the model of undeformed chip thickness was established in this article. According to the data of micro-groove surface roughness from the diamond fly-cutting experiment, the nonlinear relationship curve, between the largest undeformed chip thicknesshmaxand microgroove surface roughnessRa,were obtained using Gaussian-fitting principle, and the regression equation of the fitting curve was also got. Thus the prediction mathematical model of microgroove surface roughness was derived. The influence laws of the main working parameters on theRawere obtained based on the result of this experiment and the response surface of the prediction model, and some conclusions were summarized: the surface roughnessRaof microgroove in the single crystal silicon decreases with the decrease of the cutting depthap, the feed f and the increase of the spindle speednunder the diamond fly-cutting; the experimental results also showed that feedfaffects the value ofRavery much, cutting depthapless, and spindle speednthe least.

Study on ductile mode machining of single-crystal silicon by mechanical machining

2017 ◽  
Vol 113 ◽  
pp. 1-9 ◽  
Author(s):  
Dae-Hee Choi ◽  
Je-Ryung Lee ◽  
Na-Ri Kang ◽  
Tae-Jin Je ◽  
Ju-Young Kim ◽  
...  
Keyword(s):  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Ductile Mode ◽  
Mechanical Machining

Potential Analysis in Nanoturning of Single Crystal Silicon Using Molecular Dynamics

2011 ◽  
Vol 239-242 ◽  
pp. 3236-3239 ◽  
Author(s):  
Ying Chun Liang ◽  
Zhi Guo Wang ◽  
Ming Jun Chen ◽  
Jia Xuan Chen ◽  
Zhen Tong
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Diamond Tool ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Potential Analysis ◽  
Ductile Mode ◽  
Tool Surface ◽  
Dynamics Simulations ◽  
Nanoscale Cutting

Molecular dynamics simulations of the single crystal silicon nanoscale cutting with a diamond tool in ductile mode are carried out to investigate the adhesion phenomenon. After relaxation the silicon atoms on the surface reconstruct to make the potential decrease. The silicon atoms close to the diamond tool have the lowest potential (<-5.5 eV) and form a stable structure with surface atoms on the tool surface.

Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon

2008 ◽  
Vol 375-376 ◽  
pp. 11-16 ◽  
Author(s):  
Ming Hai Wang ◽  
Ze Sheng Lu
Keyword(s):  
Single Crystal ◽  
Chip Thickness ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Precision Turning ◽  
Brittle Ductile Transition ◽  
Transition Mechanism ◽  
Effect Theory ◽  
Ultra Precision ◽  
Cutting Model

According to the size effect theory established on the concept of geometrically necessary dislocations and results of nano-indentation experiments, a novel brittle-ductile mechanism of ultra-precision turning of single crystal silicon is proposed. The accurate critical chip thickness is firstly calculated on the basis of theoritical analysis. A macro-micro cutting model is created based on the brittle-ductile transition mechanism. Finally, the results of study are testified through experiments.

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