In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

Materials Science and Engineering A ◽

10.1016/j.msea.2012.08.069 ◽

2012 ◽

Vol 558 ◽

pp. 649-655 ◽

Author(s):

Mingna Wang ◽

Jianqiu Wang ◽

Hao Feng ◽

Wei Ke

Keyword(s):

Fracture Behavior ◽

Lead Free ◽

In Situ Observation ◽

Lead Free Solder ◽

Bending Tests ◽

Three Point Bending ◽

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In-situ observation on electrochemical migration of lead-free solder joints under water drop test

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607147 ◽

2008 ◽

Author(s):

Y.H. Xia ◽

W. Jillek ◽

E. Schmitt

Keyword(s):

Solder Joints ◽

Drop Test ◽

Lead Free ◽

In Situ Observation ◽

Electrochemical Migration ◽

Lead Free Solder ◽

Water Drop Test ◽

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In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy

Journal of Electronic Materials ◽

10.1007/s11664-008-0600-7 ◽

2008 ◽

Vol 38 (3) ◽

pp. 400-409 ◽

Author(s):

Yong Sun ◽

Jin Liang ◽

Zhi-Hui Xu ◽

Guofeng Wang ◽

Xiaodong Li

Keyword(s):

Solder Alloy ◽

Lead Free ◽

Small Scale ◽

In Situ Observation ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder

Journal of Electronic Materials ◽

10.1007/s11664-005-0258-3 ◽

2005 ◽

Vol 34 (10) ◽

pp. 1324-1335 ◽

Author(s):

Ying Ding ◽

Chunqing Wang ◽

Mingyu Li

Keyword(s):

Electron Microscope ◽

Scanning Electron Microscope ◽

Fracture Behavior ◽

Lead Free ◽

Lead Free Solder ◽

In Situ Investigation ◽

Free Solder ◽

Scanning Electron

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In-situ observation on the twinning boundary movement of pure zirconium during three-point bending tests

Materials Science and Engineering A ◽

10.1016/j.msea.2021.142361 ◽

2021 ◽

pp. 142361

Author(s):

Jie Ren ◽

Geping Li ◽

Fusen Yuan ◽

Fuzhou Han ◽

Muhammad Ali ◽

...

Keyword(s):

In Situ Observation ◽

Bending Tests ◽

Three Point Bending ◽

Boundary Movement ◽

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Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement

Microelectronics Reliability ◽

10.1016/j.microrel.2007.08.004 ◽

2008 ◽

Vol 48 (3) ◽

pp. 438-444 ◽

Author(s):

Li Jiang ◽

Keling Yang ◽

Jiemin Zhou ◽

Ke Xiang ◽

Wenjie Wang

Keyword(s):

Creep Strain ◽

Solder Joints ◽

Lead Free ◽

Resistance Measurement ◽

Lead Free Solder ◽

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In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763635 ◽

2008 ◽

Author(s):

A. Seman ◽

N.N. Ekere ◽

S.J. Ashenden ◽

S. Mallik ◽

A.E. Marks ◽

...

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Surface Mount ◽

Solder Pastes ◽

Free Solder ◽

Non Destructive

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-011-0538-z ◽

2011 ◽

Vol 23 (1) ◽

pp. 136-147 ◽

Author(s):

Yanhong Tian ◽

Wei Liu ◽

Rong An ◽

Wei Zhang ◽

Lina Niu ◽

...

Keyword(s):

Tensile Test ◽

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Fracture Behaviors ◽

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In Situ Measurement of Ionic Migration of Lead-Free Solder by Quartz Crystal Microbalance.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.50.1142 ◽

1999 ◽

Vol 50 (12) ◽

pp. 1142-1146 ◽

Author(s):

Makoto NAKAMURA ◽

Hirokazu TANAKA ◽

Sachio YOSHIHARA ◽

Takashi SHIRAKASHI

Keyword(s):

Quartz Crystal Microbalance ◽

Quartz Crystal ◽

In Situ Measurement ◽

Lead Free ◽

Lead Free Solder ◽

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Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

Journal of Electronic Materials ◽

10.1007/s11664-010-1080-0 ◽

2010 ◽

Vol 39 (3) ◽

pp. 273-282 ◽

Author(s):

John W. Elmer ◽

Eliot D. Specht ◽

Mukul Kumar

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

In Situ Observations ◽

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Effects of isothermal aging and in-situ current stress on the reliability of lead-free solder joints

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490790 ◽

2010 ◽

Author(s):

Anurag Bansal ◽

Tae-Kyu Lee ◽

Kuo-Chuan Liu ◽

Jie Xue

Keyword(s):

Isothermal Aging ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Current Stress ◽

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