Closed-form internal impedance model and characterization of mixed carbon nanotube bundles for three-dimensional integrated circuits

2018 ◽  
Vol 27 (1) ◽  
pp. 017303 ◽  
Author(s):  
Qijun Lu ◽  
Zhangming Zhu ◽  
Yintang Yang ◽  
Ruixue Ding ◽  
Yuejin Li
Keyword(s):  
Carbon Nanotube ◽  
Integrated Circuits ◽  
Closed Form ◽  
Three Dimensional ◽  
Impedance Model ◽  
Nanotube Bundles ◽  
Internal Impedance

Thermal characterization of single-wall carbon nanotube bundles using the self-heating 3ω technique

2006 ◽  
Vol 100 (12) ◽  
pp. 124314 ◽  
Author(s):  
Jinbo Hou ◽  
Xinwei Wang ◽  
Pallavi Vellelacheruvu ◽  
Jiaqi Guo ◽  
Chang Liu ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Characterization ◽  
The Self ◽  
Single Wall Carbon Nanotube ◽  
Single Wall Carbon ◽  
Nanotube Bundles ◽  
Self Heating ◽  
3Ω Technique

Design and Characterization of Three-Dimensional Carbon Nanotube Foams

2006 ◽  
Vol 110 (42) ◽  
pp. 21377-21380 ◽  
Author(s):  
Sumanjeet Kaur ◽  
Pulickel M. Ajayan ◽  
Ravi S. Kane
Keyword(s):  
Carbon Nanotube ◽  
Three Dimensional

scholarly journals THERMAL CHARACTERIZATION OF MULTI-WALL CARBON NANOTUBE BUNDLES BASED ON PULSED LASER-ASSISTED THERMAL RELAXATION

2008 ◽  
Vol 01 (01) ◽  
pp. 71-76 ◽  
Author(s):  
JIAQI GUO ◽  
XINWEI WANG ◽  
DAVID B. GEOHEGAN ◽  
GYULA ERES
Keyword(s):  
Carbon Nanotube ◽  
Thermal Diffusivity ◽  
Thermal Relaxation ◽  
Thermal Characterization ◽  
Nanosecond Laser ◽  
One Dimensional ◽  
Nanotube Bundles ◽  
The Wire ◽  
Multi Wall Carbon Nanotube

A novel transient technique is developed to measure the thermal diffusivity of one-dimensional microscale wires. In this technique, a pulsed nanosecond laser is used to quickly heat the wire. After laser heating, the wire temperature decays slowly. Such temperature decay is sensed and used to determine the thermal diffusivity of the wire. A 25.4 μm thin Pt wire is characterized to verify this technique. The thermal diffusivity of multi-wall carbon nanotube bundles is measured. Based on the measurement result and the inside structure, the thermal diffusivity of individual carbon nanotubes is estimated.

Speeding up carbon nanotube integrated circuits through three-dimensional architecture

Nano Research ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1810-1816 ◽  
Author(s):  
Yunong Xie ◽  
Zhiyong Zhang ◽  
Donglai Zhong ◽  
Lianmao Peng
Keyword(s):  
Carbon Nanotube ◽  
Integrated Circuits ◽  
Three Dimensional
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