scholarly journals Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits

2014 ◽  
Vol 20 (S3) ◽  
pp. 1762-1763
Author(s):  
Ann N. Chiaramonti ◽  
Sten Vollebregt ◽  
Aric W. Sanders ◽  
Ryoichi Ishihara ◽  
David T. Read
2003 ◽  
Vol 368 (3-4) ◽  
pp. 510
Author(s):  
Yuesheng Ning ◽  
Xiaobin Zhang ◽  
Youwen Wang ◽  
Yanlin Sun ◽  
Lihua Shen ◽  
...  

2019 ◽  
Vol 16 (10) ◽  
pp. 909-916
Author(s):  
Jin-Hong Park ◽  
Munehiro Tada ◽  
Hyun-Yong Yu ◽  
Duygu Kuzum ◽  
Yeul Na ◽  
...  

Carbon ◽  
2011 ◽  
Vol 49 (5) ◽  
pp. 1680-1691 ◽  
Author(s):  
Xiaopeng Huang ◽  
Jianmei Wang ◽  
Gyula Eres ◽  
Xinwei Wang

2012 ◽  
Vol 59 (7) ◽  
pp. 1941-1947 ◽  
Author(s):  
M. R. Lueck ◽  
J. D. Reed ◽  
C. W. Gregory ◽  
A. Huffman ◽  
J. M. Lannon ◽  
...  

2008 ◽  
Vol 01 (01) ◽  
pp. 71-76 ◽  
Author(s):  
JIAQI GUO ◽  
XINWEI WANG ◽  
DAVID B. GEOHEGAN ◽  
GYULA ERES

A novel transient technique is developed to measure the thermal diffusivity of one-dimensional microscale wires. In this technique, a pulsed nanosecond laser is used to quickly heat the wire. After laser heating, the wire temperature decays slowly. Such temperature decay is sensed and used to determine the thermal diffusivity of the wire. A 25.4 μm thin Pt wire is characterized to verify this technique. The thermal diffusivity of multi-wall carbon nanotube bundles is measured. Based on the measurement result and the inside structure, the thermal diffusivity of individual carbon nanotubes is estimated.


Nano Research ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1810-1816 ◽  
Author(s):  
Yunong Xie ◽  
Zhiyong Zhang ◽  
Donglai Zhong ◽  
Lianmao Peng

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