scholarly journals Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package

2018 ◽  
Vol 1082 ◽  
pp. 012015
Author(s):  
M.A. Azmi ◽  
M.K. Abdullah ◽  
M.Z. Abdullah ◽  
Z.M. Ariff ◽  
M.A. Ismail ◽  
...  
Heliyon ◽  
2019 ◽  
Vol 5 (6) ◽  
pp. e01845
Author(s):  
Suresh Kumar Yatirajula ◽  
Anuj Shrivastava ◽  
Vinod Kumar Saxena ◽  
Jagadeeshwar Kodavaty

Author(s):  
HANGYU HU ◽  
XUEMENG ZHAI ◽  
MINGDA WANG ◽  
GUANGMIN HU

Graph-based approaches have been widely employed to facilitate in analyzing network flow connectivity behaviors, which aim to understand the impacts and patterns of network events. However, existing approaches suffer from lack of connectivity-behavior information and loss of network event identification. In this paper, we propose network flow connectivity graphs (NFCGs) to capture network flow behavior for modeling social behaviors from network entities. Given a set of flows, edges of a NFCG are generated by connecting pairwise hosts who communicate with each other. To preserve more information about network flows, we also embed node-ranking values and edge-weight vectors into the original NFCG. After that, a network flow connectivity behavior analysis framework is present based on NFCGs. The proposed framework consists of three modules: a graph simplification module based on diversified filtering rules, a graph feature analysis module based on quantitative or semiquantitative analysis, and a graph structure analysis module based on several graph mining methods. Furthermore, we evaluate our NFCG-based framework by using real network traffic data. The results show that NFCGs and the proposed framework can not only achieve good performance on network behavior analysis but also exhibit excellent scalability for further algorithmic implementations.


2014 ◽  
Vol 454 (1-3) ◽  
pp. 37-45 ◽  
Author(s):  
Kanwarjeet Singh ◽  
S. Latha ◽  
M. Nandagopal ◽  
M.D. Mathew ◽  
K. Laha ◽  
...  

1998 ◽  
Vol 515 ◽  
Author(s):  
P. C. Li ◽  
G. L. Lehmann ◽  
J. Cascio ◽  
T. Driscoll ◽  
Y. J. Huang ◽  
...  

ABSTRACTIn flip-chip packaging an underfill mixture is placed into the chip-to-substrate standoff created by the array of solder bumps, using a capillary flow process. The flow behavior is a complex function of the mixture properties, the wetting properties, and the flow geometry. This paper reports on the use of a plane channel capillary flow to characterize underfill materials. The measured flow behavior provides evidence that both the contact angle (θ) and the suspension viscosity (μapp) vary with time under the Influence of changing flow conditions. This nonlinear fluid behavior is modeled for the flow of both model suspensions and commercial underfill materials using an extended Washburn model.


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