scholarly journals Registration of the optical output signal of distributed mechanoluminescent impulse pressure sensors

2019 ◽  
Vol 1399 ◽  
pp. 022023 ◽  
Author(s):  
K V Tatmyshevskiy ◽  
D D Pavlov
Keyword(s):  
Output Signal ◽  
Pressure Sensors ◽  
Optical Output ◽  
Impulse Pressure

Development of circuit solution and design of capacitive pressure sensor array for applied robotics

2020 ◽  
Vol 8 (4) ◽  
pp. 296-307
Author(s):  
Konstantin Krestovnikov ◽  
Aleksei Erashov ◽  
Аleksandr Bykov
Keyword(s):  
Pressure Sensor ◽  
Output Signal ◽  
Sensor Array ◽  
Applied Pressure ◽  
Pressure Sensors ◽  
Fine Tuning ◽  
Capacitive Pressure Sensor ◽  
Cell Parameters ◽  
Linear Pattern ◽  
Sensor Structure

This paper presents development of pressure sensor array with capacitance-type unit sensors, with scalable number of cells. Different assemblies of unit pressure sensors and their arrays were considered, their characteristics and fabrication methods were investigated. The structure of primary pressure transducer (PPT) array was presented; its operating principle of array was illustrated, calculated reference ratios were derived. The interface circuit, allowing to transform the changes in the primary transducer capacitance into voltage level variations, was proposed. A prototype sensor was implemented; the dependency of output signal power from the applied force was empirically obtained. In the range under 30 N it exhibited a linear pattern. The sensitivity of the array cells to the applied pressure is in the range 134.56..160.35. The measured drift of the output signals from the array cells after 10,000 loading cycles was 1.39%. For developed prototype of the pressure sensor array, based on the experimental data, the average signal-to-noise ratio over the cells was calculated, and equaled 63.47 dB. The proposed prototype was fabricated of easily available materials. It is relatively inexpensive and requires no fine-tuning of each individual cell. Capacitance-type operation type, compared to piezoresistive one, ensures greater stability of the output signal. The scalability and adjustability of cell parameters are achieved with layered sensor structure. The pressure sensor array, presented in this paper, can be utilized in various robotic systems.

Dynamic modeling of liquid impulse pressure generator for calibration of pressure sensors

2018 ◽  
Vol 279 ◽  
pp. 120-131 ◽  
Author(s):  
Jun Yang ◽  
Shangchun Fan ◽  
Bo Li ◽  
Riheng Huang ◽  
Yusong Shi ◽  
...  
Keyword(s):  
Dynamic Modeling ◽  
Pressure Sensors ◽  
Pressure Generator ◽  
Impulse Pressure

scholarly journals Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks

2018 ◽  
Vol 4 (1) ◽  
pp. 595-598
Author(s):  
Roland Fischer ◽  
Heinrich Ditler ◽  
Michael Görtz ◽  
Wilfried Mokwa
Keyword(s):  
Mechanical Stress ◽  
Pressure Sensor ◽  
Output Signal ◽  
Strong Dependence ◽  
Pressure Sensors ◽  
Target Thickness ◽  
Sensor Output ◽  
Additional Information ◽  
Four Point Bending ◽  
Foil Substrate

AbstractArtificial limbs, equipped with miniaturized tactile sensors, can handle objects with more dexterousness. Next to detecting forces, the sensor devices are also able to measure temperature. With this additional information, the touched objects can be better characterized. As such sensors, active CMOS-based capacitive pressure sensors are used in this work. The Sensors are thinned to 20-30 μm target thickness to make them bendable. One challenge of such thin sensors is the strong dependence of the output signal upon bending. To compensate this dependency, two sensors were mounted back to back. This allows a numerical adjustment of the two characteristic sensor output signals to mechanical stress curves. After electrically contacting of the stacks with a 15 μm thin polyimide foil substrate, the bending dependence of the stacks was characterized with a four-point bending procedure. By this characterization the dependency of the pressure sensor output signal on the height of mechanical stress was determined. Both sensor output signals show an inverted behavior under the same mechanical stress which confirmed prior simulation results with the same setup. Based on this information, a numerical method for compensating the bending dependence was successfully proven.

scholarly journals Investigation of sensitive element for pressure sensor based on bipolar piezotransistor

2021 ◽  
Author(s):  
Mikhail ◽  
Denis Prigodskiy
Keyword(s):  
Pressure Sensor ◽  
Output Signal ◽  
Dynamic Range ◽  
Strong Dependence ◽  
Pressure Sensors ◽  
High Sensitivity ◽  
Wheatstone Bridge ◽  
Differential Amplifier ◽  
Sensor Output ◽  
Thin Part

The article translated from Russian to English on pp. 691-693 (please, look down). The paper summarizes results of investigation of high-sensitivity MEMS pressure sensor based on a circuit containing both active and passive stress-sensitive elements: a differential amplifier utilizing two n-p-n piezotransistors and for p-type piezoresistors. A comparative analysis of a sensor utilizing this circuit with a pressure sensor based on traditional piezoresistive Wheatstone bridge and built on the same mechanical part is provided. MEMS pressure sensor with the differential amplifier (PSDA) has sensitivity of S = 0.66 mV/kPa/V, which exceeded the sensitivity of the element with piezoresistive Wheatstone bridge (PSWB) by 2.2 times. The sensitivity increase allows for the following sensor improvements: die size reduction, increase of diaphragm mechanical strength while keeping high pressure sensitivity, and simplifying requirements to external processing of the pressure sensor output signal. There are two main challenges related to the use of PSDA-based pressure sensors: strong dependence of output signal on temperature and higher than in PSWB noise reducing the dynamic range of the device to 10 3. The article describes methods of addressing these problems. The temperature dependence of sensor output signal can be minimized with help of an offset thermal compensation circuit and by eliminating metallization at the thin part of the diaphragm. The noise can be minimized by reducing the thickness of the active base region of the transistor. Circuit analysis with software NI Multisim shows that sensitivity of PSDA-based pressure sensor can be increased 2.3 times by circuit optimization.

scholarly journals New type of Piezoresistive Pressure Sensors for Environments with Rapidly Changing Temperature

2017 ◽  
Vol 24 (1) ◽  
pp. 185-192 ◽  
Author(s):  
Myroslav Tykhan ◽  
Orest Ivakhiv ◽  
Vasyl Teslyuk
Keyword(s):  
Output Signal ◽  
Variable Temperature ◽  
Linear Thermal Expansion ◽  
Pressure Sensors ◽  
Practical Implementation ◽  
Sensor Output ◽  
New Type ◽  
Accuracy Of Measurement ◽  
Piezoresistive Pressure Sensors ◽  
Physical Principles

Abstract The theoretical aspects of a new type of piezo-resistive pressure sensors for environments with rapidly changing temperatures are presented. The idea is that the sensor has two identical diaphragms which have different coefficients of linear thermal expansion. Therefore, when measuring pressure in environments with variable temperature, the diaphragms will have different deflection. This difference can be used to make appropriate correction of the sensor output signal and, thus, to increase accuracy of measurement. Since physical principles of sensors operation enable fast correction of the output signal, the sensor can be used in environments with rapidly changing temperature, which is its essential advantage. The paper presents practical implementation of the proposed theoretical aspects and the results of testing the developed sensor.

Investigation of Packaging Effect of Silicon-Based Piezoresistive Pressure Sensor

2006 ◽  
Author(s):  
Chen-Hing Chu ◽  
Tsung-Lin Chou ◽  
Chun-Te Lin ◽  
Kuo-Ning Chiang
Keyword(s):  
Pressure Sensor ◽  
Output Signal ◽  
High Performance ◽  
Pressure Sensors ◽  
Design Parameters ◽  
Silicone Gel ◽  
Piezoresistive Pressure Sensor ◽  
Signal Sensitivity ◽  
Silicon Based ◽  
Packaging Effect

The silicon-based pressure sensor is one of the major applications in the MEMS device. Nowadays, the silicon piezoresistive pressure sensor is a mature technology in industry and its measurement accuracy is more rigorous in many advanced applications. In order to operate the piezoresistive pressure sensor in harsh environment, the silicone get is usually used to protect the die surface and wire bond while allowing the pressure signal to be transmitted to the silicon diaphragm. The major factor affecting the high performance applications of the piezoresistive pressure sensor is the temperature dependence of its pressure characteristics. Therefore, the thermal and packaging effects caused by the silicone gel behaviors should be taken into consideration to obtain better sensor accuracy and sensitivity. For this reason, a finite element method (FEM) is adopted for the sensor performance evaluation, and the thermal and pressure loading is applied on the sensor to study the output signal sensitivity as well as the packaging-induced signal variation, thermal/packaging effect reduction, and output signal prediction for the pressure sensors. The design parameters include silicon die size, silicone gel geometry and its material properties. The simulation results show that the smaller die size and the thicker die thickness can reduce the packaging-induced thermal effect. Furthermore, the different geometry of silicone gel also influences the sensitivity of pressure sensor.

Investigation of Gap Dependency of Distortion in Output Signal from Scale Slit of Optical Encoder

2010 ◽  
Vol 130 (12) ◽  
pp. 1356-1362
Author(s):  
Hajime Nakajima ◽  
Kazuhiko Sumi ◽  
Hiroshi Inujima
Keyword(s):  
Output Signal ◽  
Optical Encoder

New Bounds on the Feedforward Design of Optical Output Buffer Multiplexers and Switches

2009 ◽  
Vol E92-B (4) ◽  
pp. 1183-1190 ◽  
Author(s):  
Xiaoliang WANG ◽  
Xiaohong JIANG ◽  
Susumu HORIGUCHI
Keyword(s):  
Output Buffer ◽  
Optical Output
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