scholarly journals Quality control in cyber-physical systems of smart electronics manufacturing

2021 ◽  
Vol 2094 (4) ◽  
pp. 042066
Author(s):  
A A Dzyubanenko ◽  
G I Korshunov

Abstract The creation of high-tech smart industries is observed in dynamically developing industries, which include the production of electronics and the automotive industry. The concept of “smart manufacturing” is closely related to the concept of cyber-physical systems, which integrates the main elements of digitalization and intellectualization. This concept provides for the continuous improvement of intellectual “cybernetic” resources for the effective management of the “physical” environment considered in this problem area. Improvement of technologies, ensuring high rates of reproducibility and suitability of equipment creates conditions for defect-free production. However, there remain the problems of recognizing patterns represented not by an obvious marriage, but by some not fully defined inconsistency on a set of requirements. The need to disclose uncertainties of this kind is typical for surface mounting technologies for printed circuit boards. The introduction of more and more advanced automatic optical inspections, containing the possibility of introducing intelligent (cybernetic) means, creates conditions for improving the quality of printed circuit boards as a “physical” environment. It is also important to minimize the “human factor”, the presence of which is still used when making decisions on the results of control. In the article, ensuring the rhythm of digital production and increasing the reliability of control in quality management in smart high-tech industries using the example of electronics production.

2005 ◽  
Vol 127 (4) ◽  
pp. 370-374 ◽  
Author(s):  
X. B. Chen

In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding and characterization of the flow behavior of the fluid being dispensed is very important, as the behavior can have a significant influence on the dispensing process. However, this task has proven to be very challenging due to the fact that the fluids for electronics packaging usually exhibit the time-dependent rheological behavior, which has not been well defined in literature. In the paper a study on the characterization of the time-dependent rheological behavior of the fluids for electronics packaging is presented. In particular, a model is developed based on structural theory and then applied to the characterization of the decay and recovery of fluid behavior, which happen in the dispensing process due to the interruption of process. Experiments are carried out to verify the effectiveness of the model developed.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


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