scholarly journals Radiation-doped SiC*/Si heterostructure formation and defects evolution

2022 ◽  
Vol 2155 (1) ◽  
pp. 012012
Author(s):  
V I Chepurnov ◽  
M V Dolgopolov ◽  
A V Gurskaya ◽  
G V Puzyrnaya ◽  
D E Elkhimov

Abstract The authors consider heterostructures of silicon carbide obtained during endotaxy on silicon substrates. The question is raised in connection with the description of the endotaxy process itself at the structural level. Authors focus on the technological aspects of the formation of a stable β-SiC/Si heterostructure by endotaxy in relation to the evolution of point defects of various nature and their probable association models with the participation of a radionuclide impurity at the micro-alloying level: 1) the growth of the SiC*/Si thin layer with C-14 atoms in the doping process; 2) physical properties of defects formation; 3) some interface between properties and efficiency.

2017 ◽  
Vol 18 (9) ◽  
pp. 164-179
Author(s):  
V.I. Tchepurnov

Heteroepitaxy layers of silicon carbide on silicon substrates is one of the best candidates for high-power, high-temperature and high-frequency applications in electronics. Solid-phase process of endotaxe of silicon carbide is accompanied by evolution of Si-phase into Sic-one in hydrogen hydrocarbon atmosphere at temperature range 1360-1380 °C and normal pressure. The distribution of thermal intrinsic point defects of different nature in silicon substrates in dependence of the type of its conductivity and in conditions of isovalent doping of carbon is investigated in this paper.


1994 ◽  
Vol 354 ◽  
Author(s):  
L. Simon ◽  
A. Mesu ◽  
J. J. Grob ◽  
T. Heiser ◽  
J. L. Balladore

AbstractWe report on p-SiC thin layer synthesis by carbon ion implantation at high temperature. Infra-red and RBS analysis were performed on samples implanted at temperatures ranging from 200 to 900°C and for carbon doses varying in the range 1017to2.1018 cm . RBS analysis does not reveal any diffusion or segregation of carbon up to 900°C. At this temperature we obtained the optimum Infra-red signature. The (3-SiC formation is shown to be a thermally activated process with an energy of 0.1 eV leading us to speculate that the diffusion of point defects could be the limiting factor of the process.


Alloy Digest ◽  
1997 ◽  
Vol 46 (11) ◽  

Abstract Lanxide 92-X-2050 is an aluminum-10 Silicon-1 Magnesium-1 Iron alloy with 30 vol.% of silicon carbide particulate. This metal-matrix composite is designed to outperform the unreinforced counterpart. The alloy-matrix composite is available as die castings. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as fatigue. It also includes information on casting. Filing Code: AL-343. Producer or source: Lanxide Corporation.


MRS Bulletin ◽  
1997 ◽  
Vol 22 (3) ◽  
pp. 25-29 ◽  
Author(s):  
W.J. Choyke ◽  
G. Pensl

While silicon carbide has been an industrial product for over a century, it is only now emerging as the semiconductor of choice for high-power, high-temperature, and high-radiation environments. From electrical switching and sensors for oil drilling technology to all-electric airplanes, SiC is finding a place which is difficult to fill with presently available Si or GaAs technology. In 1824 Jöns Jakob Berzelius published a paper which suggested there might be a chemical bond between the elements carbon and silicon. It is a quirk of history that he was born in 1779 in Linköping, Sweden where he received his early education, and now, 172 years later, Linkoping University is the center of a national program in Sweden to study the properties of SiC as a semiconductor.


1984 ◽  
Vol 84 (2) ◽  
pp. K143-K147 ◽  
Author(s):  
P. Lošť??k ◽  
J. Horák ◽  
L. Koudelka

1986 ◽  
Vol 28 (2) ◽  
pp. 103-113
Author(s):  
Toshiaki IKOMA ◽  
Yasunori MOCHIZUKI

1994 ◽  
Vol 339 ◽  
Author(s):  
L. Rimai ◽  
R. Ager ◽  
W. H. Weber ◽  
J. Hangas ◽  
B. D. Poindexter

ABSTRACTSilicon carbide films are grown epitaxially on crystalline silicon substrates heated above 1000 °C, by laser ablation of pure carbon targets to thicknesses between 300 and 400 nm. These films grow on top of the silicon substrate from the carbon in the ablation plume and from the silicon of the substrate. By using a method of alternate ablation of a pure carbon and a pure silicon target, similar epitaxial films can be grown to thicknesses in excess of 1 μm with part of the silicon being supplied by the ablation plume of the silicon target.


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