scholarly journals Numerical investigation on air-cooling enhancement of a motor cycle engine by varying fins geometry

2021 ◽  
Vol 1123 (1) ◽  
pp. 012045
Author(s):  
Bibhuti B Sahoo ◽  
Chandrakanta Nayak ◽  
Mukul Shrivastava
Author(s):  
Ramy Abdelmaksoud ◽  
Ting Wang

Abstract This paper describes a numerical investigation to study the effect of injecting mist (tiny water droplets, micrometers in size) into the cooling airstream to cool down gas turbine vanes. In this study, the conjugate heat transfer method is employed which consists of the simulation of the air/mist fluid flow inside and outside the vanes as well as the heat conduction through the vane body. The complete 3-D vane with internal cooling passages and external film cooling holes on the surface is simulated in a rotational periodic sector. The discrete phase model (DPM) is used to simulate and track the evaporation and movement of the tiny water droplets. The effects of different parameters such as the mist/air ratio (10–20%) and the mist droplets size (20–50μm) on mist cooling enhancement are investigated. The results show that by using a mist/air ratio of 10%, 15%, and 20% with 20 μm droplets size, on the pressure side, a maximum wall temperature reduction of 250 K, 340 K, and 450 K respectively can be achieved. On the suction side, the corresponding maximum wall temperature reductions are 160 K, 260 K, and 360 K, respectively. Using larger droplets of 50μm did not achieve better cooling enhancement because the droplets were rushed far away from the surface by the acceleration through the film cooling holes. Using the uniform droplet size distribution provides noticeably better cooling enhancement in the first 40% of the vane’s height (from the shroud) than the non-uniform droplet size distribution (Rosin-Rammler Distribution) does.


2014 ◽  
Vol 136 (2) ◽  
Author(s):  
Yonghui Xie ◽  
Zhongyang Shen ◽  
Di Zhang ◽  
Jibing Lan

With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling approach in electronic microdevices due to better thermal performance than air cooling method. In the present paper, thermal performance in microchannels with grooves and obstacles are investigated numerically. The height and width of the rectangular microchannel are 200 and 50 μm, respectively. As a simple modification of dimple/protrusion, the groove/obstacle diameter is 100 μm and the depth is 20 μm. Different arrangements of grooves and obstacles are considered on Reynolds range of 100–900. The numerical results show that groove/obstacle structure is effective for cooling enhancement in microchannel. Among the cases in this research, the normalized Nusselt number Nu/Nu0 is within the range of 1.446–26.19, while the pressure penalty f/f0 has a much larger range from 0.86 to 110.18 depending on specific orientation. Field synergy analysis and performance evaluation plot are adopted to discuss the mechanism of heat transfer enhancement and energy saving performance integrating the pumping performance. From the viewpoint of energy saving, groove on single surface (case 1) has the best performance. Furthermore, performances of grooved microchannels are compared with that of dimpled microchannels which were discussed in the author’s previous research. The results indicate grooved microchannels have larger range of both Nu/Nu0 and f/f0 and some grooved cases possess high TP than dimpled microchannels.


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