High thermally conductive and electrically insulating 2D boron nitride nanosheet for efficient heat dissipation of high-power transistors

2D Materials ◽  
2016 ◽  
Vol 3 (4) ◽  
pp. 041009 ◽  
Author(s):  
Ziyuan Lin ◽  
Chunru Liu ◽  
Yang Chai
Keyword(s):  
Boron Nitride ◽  
High Power ◽  
Heat Dissipation ◽  
Power Transistors ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive

Thermally conductive, dielectric PCM–boron nitride nanosheet composites for efficient electronic system thermal management

Nanoscale ◽  
2016 ◽  
Vol 8 (46) ◽  
pp. 19326-19333 ◽  
Author(s):  
Zhi Yang ◽  
Lihui Zhou ◽  
Wei Luo ◽  
Jiayu Wan ◽  
Jiaqi Dai ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Thermal Management ◽  
Electronic System ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive

Study on the ALN Thin Film for Improving the Performance of Heat Dissipation on High Power LED Substrate

2013 ◽  
Vol 834-836 ◽  
pp. 613-616 ◽  
Author(s):  
Yang Li ◽  
Chen Kui ◽  
Hui Ren Peng ◽  
Ming Jia Zhu ◽  
Ya Wen Pan ◽  
...  
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
Direct Current ◽  
High Power ◽  
Heat Dissipation ◽  
Aluminum Substrate ◽  
Back Side ◽  
Dc Magnetron Sputtering ◽  
High Power Led ◽  
Thermally Conductive

This dissertation employs the method of direct current (DC) magnetron sputtering on the reverse side of the high power LED aluminum substrate to deposit the AlN thin film. And then, we paste the high power LED beads to the front of the substrate, testing and studying the heat dissipation influences of the AlN thin film on the high-power LED beads. In order to compare easily, some parts of the reverse of aluminum substrate should be overlaid thermally conductive silicone. The result indicates that depositing the AIN thin film or the overlay thermally conductive silicone on the back side of the aluminum substrate can improve the heat dissipation capability of high power LED, the AIN thin film especially.

Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Stability ◽  
Heat Dissipation ◽  
Thermoplastic Polyurethane ◽  
Thermally Conductive ◽  
Mechanical Bending ◽  
Flexible Polyurethane ◽  
Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

scholarly journals Fabrication of High Thermally Conductive and Electrical Insulating Composites by Boron Nitride‐Nanosheet‐Coated PEEK Fiber

2021 ◽  
Vol 306 (12) ◽  
pp. 2170050
Author(s):  
Youli Sun ◽  
Hongbo Dang ◽  
HaoYuan Tan ◽  
Jiashuang Luan ◽  
Dong Jiang ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive

scholarly journals Highly thermally conductive and electrically insulating polymer nanocomposites with boron nitride nanosheet/ionic liquid complexes

RSC Advances ◽  
2017 ◽  
Vol 7 (58) ◽  
pp. 36450-36459 ◽  
Author(s):  
Takuya Morishita ◽  
Naoko Takahashi
Keyword(s):  
Ionic Liquid ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Polymer Nanocomposites ◽  
Electrical Insulation ◽  
Significant Enhancement ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive ◽  
Thermal Conductivities

Boron nitride nanosheet (BNNS)/ionic liquid (IL)/polymer composites show significant enhancement of through-plane and in-plane thermal conductivities and electrical insulation.

scholarly journals Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2191
Author(s):  
Andrzej Rybak ◽  
Lukasz Malinowski ◽  
Agnieszka Adamus-Wlodarczyk ◽  
Piotr Ulanski
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Shape Memory ◽  
Polymer Composites ◽  
Heat Dissipation ◽  
Shape Memory Polymer ◽  
Electrical Insulation ◽  
Heat Management ◽  
Crosslinked Polymer ◽  
Thermally Conductive

The evaluation of a possible application of functional shrinkable materials in thermally conductive electrical insulation elements was investigated. The effectiveness of an electron beam and gamma radiation on the crosslinking of a selected high density polyethylene grade was analyzed, both qualitatively and quantitatively. The crosslinked polymer composites filled with ceramic particles were successfully fabricated and tested. On the basis of the performed investigation, it was concluded that the selected filler, namely a boron nitride powder, is suitable for the preparation of the crosslinked polymer composites with enhanced thermal conductivity. The shape memory effect was fully observed in the crosslinked samples with a recovery factor reaching nearly 99%. There was no significant influence of the crosslinking, stretching, and recovery of the polymer composite during shape memory phenomenon on the value of thermal conductivity. The proposed boron nitride filled polyethylene composite subjected to crosslinking is a promising candidate for fabrication of thermally shrinkable material with enhanced heat dissipation functionality for application as electrically insulating components.

scholarly journals Robust Biomimetic Nacreous Aramid Nanofiber Composite Films with Ultrahigh Thermal Conductivity by Introducing Graphene Oxide and Edge-Hydroxylated Boron Nitride Nanosheet

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2544
Author(s):  
Cenkai Xu ◽  
Chengmei Wei ◽  
Qihan Li ◽  
Zihan Li ◽  
Zongxi Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Composite Film ◽  
Performance Enhancement ◽  
Composite Films ◽  
Dielectric Materials ◽  
Boron Nitride Nanosheet ◽  
Brick And Mortar ◽  
Thermally Conductive

Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity and mechanical strength for a single material remains a challenge. Herein, we report a new strategy for preparing mechanically strong and thermally conductive composite films by combining aramid nanofibers (ANFs) with graphene oxide (GO) and edge-hydroxylated boron nitride nanosheet (BNNS-OH) via a vacuum-assisted filtration and hot-pressing technique. The obtained ANF/GO/BNNS film exhibits an ultrahigh in-plane thermal conductivity of 33.4 Wm−1K−1 at the loading of 10 wt.% GO and 50 wt.% BNNS-OH, which is 2080% higher than that of pure ANF film. The exceptional thermal conductivity results from the biomimetic nacreous “brick-and-mortar” layered structure of the composite film, in which favorable contacting and overlapping between the BNNS-OH and GO is generated, resulting in tightly packed thermal conduction networks. In addition, an outstanding tensile strength of 93.3 MPa is achieved for the composite film, owing to the special biomimetic nacreous structure as well as the strong π−π interactions and extensive hydrogen bonding between the GO and ANFs framework. Meanwhile, the obtained composite film displays excellent thermostability (Td = 555 °C, Tg > 400 °C) and electrical insulation (4.2 × 1014 Ω·cm). We believe that these findings shed some light on the design and fabrication of multifunctional materials for thermal management applications.

High temperature thermal management with boron nitride nanosheets

Nanoscale ◽  
2018 ◽  
Vol 10 (1) ◽  
pp. 167-173 ◽  
Author(s):  
Yilin Wang ◽  
Lisha Xu ◽  
Zhi Yang ◽  
Hua Xie ◽  
Puqing Jiang ◽  
...  
Keyword(s):  
High Temperature ◽  
Boron Nitride ◽  
Thermal Management ◽  
Power Density ◽  
High Power ◽  
Heat Dissipation ◽  
Rapid Development ◽  
High Power Density ◽  
Boron Nitride Nanosheets

The rapid development of high power density devices requires more efficient heat dissipation.

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