Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation

The evaluation of a possible application of functional shrinkable materials in thermally conductive electrical insulation elements was investigated. The effectiveness of an electron beam and gamma radiation on the crosslinking of a selected high density polyethylene grade was analyzed, both qualitatively and quantitatively. The crosslinked polymer composites filled with ceramic particles were successfully fabricated and tested. On the basis of the performed investigation, it was concluded that the selected filler, namely a boron nitride powder, is suitable for the preparation of the crosslinked polymer composites with enhanced thermal conductivity. The shape memory effect was fully observed in the crosslinked samples with a recovery factor reaching nearly 99%. There was no significant influence of the crosslinking, stretching, and recovery of the polymer composite during shape memory phenomenon on the value of thermal conductivity. The proposed boron nitride filled polyethylene composite subjected to crosslinking is a promising candidate for fabrication of thermally shrinkable material with enhanced heat dissipation functionality for application as electrically insulating components.

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Surface modification of a BN/ETDS composite with aniline trimer for high thermal conductivity and excellent mechanical properties

RSC Advances ◽

10.1039/c8ra03875a ◽

2018 ◽

Vol 8 (40) ◽

pp. 22846-22852 ◽

Cited By ~ 7

Author(s):

Seokgyu Ryu ◽

Taeseob Oh ◽

Jooheon Kim

Keyword(s):

Mechanical Properties ◽

Thermal Conductivity ◽

Surface Modification ◽

Boron Nitride ◽

Polymer Composites ◽

Conductive Polymer ◽

High Thermal Conductivity ◽

Conductive Polymer Composites ◽

Thermally Conductive

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).

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Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

Materials Science-Poland ◽

10.1515/msp-2017-0028 ◽

2017 ◽

Vol 35 (2) ◽

pp. 382-389 ◽

Cited By ~ 16

Author(s):

Lukasz Jarosinski ◽

Andrzej Rybak ◽

Karolina Gaska ◽

Grzegorz Kmita ◽

Renata Porebska ◽

...

Keyword(s):

Thermal Conductivity ◽

Heat Dissipation ◽

Electronic Devices ◽

Graphene Nanoplatelets ◽

Electrical Insulation ◽

Graphene Nanocomposites ◽

Thermally Conductive ◽

Conductive Particles ◽

Proper Performance ◽

Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

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Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

High Performance Polymers ◽

10.1177/0954008319862044 ◽

2019 ◽

Vol 32 (3) ◽

pp. 324-333 ◽

Cited By ~ 2

Author(s):

Ting Fei ◽

Yanbao Li ◽

Baocheng Liu ◽

Chengbo Xia

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Thermal Management ◽

High Stability ◽

Heat Dissipation ◽

Thermoplastic Polyurethane ◽

Thermally Conductive ◽

Mechanical Bending ◽

Flexible Polyurethane ◽

Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

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Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Journal of Composites Science ◽

10.3390/jcs4040180 ◽

2020 ◽

Vol 4 (4) ◽

pp. 180

Author(s):

Hao Zhang ◽

Xiaowen Zhang ◽

Zhou Fang ◽

Yao Huang ◽

Hong Xu ◽

...

Keyword(s):

Thermal Conductivity ◽

Polymer Composites ◽

Thermal Conduction ◽

Heat Dissipation ◽

Conductive Polymer ◽

Electronic Equipment ◽

Functional Surface ◽

Element Analysis ◽

Conductive Polymer Composites ◽

Thermally Conductive

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

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Highly thermally conductive and electrically insulating polymer nanocomposites with boron nitride nanosheet/ionic liquid complexes

RSC Advances ◽

10.1039/c7ra06691k ◽

2017 ◽

Vol 7 (58) ◽

pp. 36450-36459 ◽

Cited By ~ 17

Author(s):

Takuya Morishita ◽

Naoko Takahashi

Keyword(s):

Ionic Liquid ◽

Boron Nitride ◽

Polymer Composites ◽

Polymer Nanocomposites ◽

Electrical Insulation ◽

Significant Enhancement ◽

Boron Nitride Nanosheet ◽

Thermally Conductive ◽

Thermal Conductivities

Boron nitride nanosheet (BNNS)/ionic liquid (IL)/polymer composites show significant enhancement of through-plane and in-plane thermal conductivities and electrical insulation.

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A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

Polymers ◽

10.3390/polym13081312 ◽

2021 ◽

Vol 13 (8) ◽

pp. 1312

Author(s):

Yeon Ju Kwon ◽

Jung Bin Park ◽

Young-Pyo Jeon ◽

Jin-Yong Hong ◽

Ho Seok Park ◽

...

Keyword(s):

Thermal Conductivity ◽

Polymer Composites ◽

Thermal Management ◽

Polymer Composite ◽

Management System ◽

Electronic Devices ◽

Electrical Insulation ◽

Thermal Management System ◽

Thermally Conductive ◽

Carbon Fillers

With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polymer-based thermal management systems has attracted much interest due to the intrinsic excellent properties of the polymer, such as the high flexibility, low cost, electrical insulation, and excellent processability. However, most polymers possess low thermal conductivity, which limits the thermal management applications of them. To address the low thermal conduction of the polymer materials, many kinds of thermally conductive fillers have been studied, and the carbon-based polymer composite is regarded as one of the most promising materials for the thermal management of the electric and electronic devices. In addition, the next generation electronic devices require composite materials with various additional functions such as flexibility, low density, electrical insulation, and oriented heat conduction, as well as ultrahigh thermal conductivity. In this review, we introduce the latest papers on thermally conductive polymer composites based on carbon fillers with sophisticated structures to meet the above requirements. The topic of this review paper consists of the following four contents. First, we introduce the design of a continuous three-dimensional network structure of carbon fillers to reduce the thermal resistance between the filler–matrix interface and individual filler particles. Second, we discuss various methods of suppressing the electrical conductivity of carbon fillers in order to manufacture the polymer composites that meet both the electrical insulation and thermal conductivity. Third, we describe a strategy for the vertical alignment of carbon fillers to improve the through-plane thermal conductivity of the polymer composite. Finally, we briefly mention the durability of the thermal conductivity performance of the carbon-based composites. This review presents key technologies for a thermal management system of next-generation electronic devices.

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Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Polymers ◽

10.3390/polym11040597 ◽

2019 ◽

Vol 11 (4) ◽

pp. 597 ◽

Cited By ~ 7

Author(s):

Van-Dung Mai ◽

Dae-Il Lee ◽

Jun-Hong Park ◽

Dai-Soo Lee

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Electronic Packaging ◽

Epoxy Resins ◽

Heat Dissipation ◽

Filler Content ◽

Electronic Devices ◽

High Thermal Conductivity ◽

Packaging Materials ◽

Thermally Conductive

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

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Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

Molecules ◽

10.3390/molecules26123555 ◽

2021 ◽

Vol 26 (12) ◽

pp. 3555

Author(s):

Lorenzo Mirizzi ◽

Mattia Carnevale ◽

Massimiliano D’Arienzo ◽

Chiara Milanese ◽

Barbara Di Di Credico ◽

...

Keyword(s):

Thermal Conductivity ◽

Heat Dissipation ◽

Interfacial Thermal Resistance ◽

Rubber Matrix ◽

Heat Management ◽

Hybrid Filler ◽

Thermal Transfer ◽

Conductive Rubber ◽

Thermally Conductive ◽

Rubber Nanocomposites

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.

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