Comparison of Starch Hydrolysis Activity and Thermal Stability of Two Bacillus licheniformis α-Amylases and Insights into Engineering α-Amylase Variants Active under Acidic Conditions

2006 ◽  
Vol 139 (6) ◽  
pp. 997-1005 ◽  
Author(s):  
Seunjae Lee ◽  
Hiroshi Oneda ◽  
Masashi Minoda ◽  
Akiyoshi Tanaka ◽  
Kuniyo Inouye
2020 ◽  
Vol 32 (7) ◽  
pp. 801-822 ◽  
Author(s):  
John J La Scala ◽  
Greg Yandek ◽  
Jason Lamb ◽  
Craig M Paquette ◽  
William S Eck ◽  
...  

4,4′-Methylenedianiline (MDA) is widely used in high-temperature polyimide resins, including polymerization of monomer reactants-15. The toxicity of MDA significantly limits the manufacturability using this resin. Modifying the substitution and electronics of MDA could allow for the reduction of toxicity while maintaining the high-performing properties of the materials derived from the modified MDA. The addition of a single methyl substituent, methoxy substituent, location of these substituents, and location of the amine relative to the phenolic bridge were modified as were other non-aniline diamines. Various anilines were condensed with paraformaldehyde under acidic conditions to yield dianilines. These dianilines and diamines were reacted with nadic anhydride and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride in methanol to form the polyamic acid oligomers and heated at elevated temperature to form polyimide oligomers. It was found that the molecular weight of the oligomers derived from MDA alternatives was generally lower than that of MDA oligomers resulting in lower glass transition temperatures ( T gs) and degradation temperatures. Additionally, methoxy substituents further reduce the T g of the polymers versus methyl substituents and reduce the thermal stability of the resin. Methyl-substituted alternatives produced polyimides with similar T gs and degradation temperatures. The toxicity of the MDA alternatives was examined. Although a few were identified with reduced toxicities, the alternatives with properties similar to that of MDA also had high toxicities.


1968 ◽  
Vol 21 (4) ◽  
pp. 821 ◽  
Author(s):  
Anne FW oodlock ◽  
BS Harrap

In the acid pH region, the relative effects of various salts on the thermal stability of the collagen helix are quite different from their effects at neutral pH. The magnitude of the decrease in thermal stability brought about by the salts studied depends mainly on the nature and concentration of the anion and very little on the nature of the cation, whereas at neutral pH the nature of both anions and cations affects the collagen helix stability, the effects of the two ions being roughly additive. The magnitude of the effect of salts at acid pH is much greater than that at neutral pH whereas for a non-ionized denaturant, urea, the magnitudes at both neutral and acid pH are similar. The data are discussed in terms of possible interactions between salts and the positively charged protein with particular consideration of the effects of salts on the pKa of protein carboxyl groups.


1993 ◽  
Vol 56 (2) ◽  
pp. 165-168 ◽  
Author(s):  
J. H. RODRIGUEZ ◽  
M. A. COUSIN ◽  
P. E. NELSON

Bacillus species are common contaminants of soil and can be found with tomatoes and other vegetables and fruits. This research was done to assess the thermal stability of spores of acid tolerant Bacillus licheniformis and Bacillus subtilis in tomato juice. The D values at 90, 95, and 100°C were 29.5, 15.8, and 5.7 min for B. subtilis and 29.9, 12.2, and 5.9 min for B. licheniformis, respectively. The z value for B. subtilis was 14°C and for B. licheniformis was 14.2°C. Aerobically, B. subtilis spores could germinate and outgrow in tomato juice (pH 4.4) within 4 d at 35°C at inoculum levels as low as 1 spore per ml; however, B. licheniformis spores could only germinate and outgrow if levels were 104 spores per mi or higher. Both Bacillus species could raise the pH of tomato juice to above 4.8 when grown aerobically. Neither B. licheniformis nor B. subtilis could germinate and outgrow anaerobically in tomato juice (pH 4.4).


2008 ◽  
Vol 15 (2) ◽  
pp. 212-214 ◽  
Author(s):  
Zahra Ghalanbor ◽  
Nasser Ghaemi ◽  
Sayed-Amir Marashi ◽  
Massoud Amanlou ◽  
Mehran Habibi-Rezaei ◽  
...  

Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization


Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


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