X-ray topography and diffraction studies of misfit dislocation nucleation in Si-based structures

Author(s):  
M. S. Goorsky ◽  
P. Feichtinger ◽  
H. Fukuto ◽  
G. U'Ren
1998 ◽  
Vol 73 (8) ◽  
pp. 1074-1076 ◽  
Author(s):  
Achim Trampert ◽  
Klaus H. Ploog ◽  
Eric Tournié

2005 ◽  
Vol 97 (10) ◽  
pp. 103506 ◽  
Author(s):  
G. Alexe ◽  
H. Heinke ◽  
L. Haase ◽  
D. Hommel ◽  
J. Schreiber ◽  
...  

2014 ◽  
Vol 778-780 ◽  
pp. 151-154 ◽  
Author(s):  
Shi Yang Ji ◽  
Kazutoshi Kojima ◽  
Yuuki Ishida ◽  
Hirotaka Yamaguchi ◽  
Shingo Saito ◽  
...  

The defect evolution on 90 μm-thick heavily Al-doped 4H-SiC epilayers with Al doping level higher than 1020 cm-3 was studied by tracing back to initial growth stage to monitor major dislocations and their propagations in each growth stage. Results from X-ray topography and KOH etching demonstrate that all existing dislocations on the surface of 90 μm-thick epilayer can be identified as the defects originating from substrate. In other words, there seems no new dislocation generated after a long-term growth. Nevertheless, a high density of misfit dislocation was found appearing near the substrate/epilayer interface for epilayer with Al doping level of 3.5×1020 cm-3, while misfit dislocation cannot be seen on epilayer with Al doping level of 1.5×1020 cm-3.


1990 ◽  
Vol 198 ◽  
Author(s):  
D.C. Houghton ◽  
N.L. Rowell

ABSTRACTThe thermal constraints for device processing imposed by strain relaxation have been determined for a wide range of Si-Ge strained heterostructures. Misfit dislocation densities and glide velocities in uncapped Sil-xGex alloy layers, Sil-xGex single and multiple quantum wells have been measured using defect etching and TEM for a range of anneal temperatures (450°C-1000°C) and anneal times (5s-2000s). The decay of an intense photoluminescence peak (∼ 10% internal quantum efficiency ) from buried Si1-xGex strained layers has been correlated with the generation of misfit dislocations in adjacent Sil-xGex /Si interfaces. The misfit dislocation nucleation rate and glide velocity for all geometries and alloy compositions (0<x<0.25) were found to be thermally activated processes with activation energies of (2.5±0.2)eV and (2.3-0.65x)eV, respectively. The time-temperature regime available for thermal processing is mapped out as a function of dislocation density using a new kinetic model.


1995 ◽  
Vol 149 (1) ◽  
pp. 123-129 ◽  
Author(s):  
N. Burle ◽  
B. Pichaud ◽  
N. Guelton ◽  
R. G. Saint-Jacques

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