scholarly journals Creation and Destruction of Morphotropic Phase Boundaries through Electrical Poling: A Case Study of Lead-Free(Bi1/2Na1/2)TiO3−BaTiO3Piezoelectrics

2012 ◽  
Vol 109 (10) ◽  
Author(s):  
Cheng Ma ◽  
Hanzheng Guo ◽  
Scott P. Beckman ◽  
Xiaoli Tan
Keyword(s):  
2015 ◽  
Vol 44 (10) ◽  
pp. 4440-4448 ◽  
Author(s):  
Xiang Lv ◽  
Jiagang Wu ◽  
Dingquan Xiao ◽  
Hong Tao ◽  
Yuan Yuan ◽  
...  

In this work, the KNNST-BNKZ-xyz ceramics were obtained, and the composition dependence of their phase structures and electrical properties was discussed.


2021 ◽  
Author(s):  
Min-Ku Lee ◽  
Byung-Hoon Kim ◽  
Gyoung-Ja Lee

Abstract The piezoelectric voltage constant (g33) is a material parameter critical to piezoelectric voltage-type sensors for detecting vibrations or strains. Here, we report a lead-free (K,Na)NbO3 (KNN)-based piezoelectric accelerometer with voltage sensitivity enhanced by taking advantage of a high g33. To achieve a high g33, the magnitudes of piezoelectric charge constant d33 and dielectric permittivity er of KNN were best coupled by manipulating the intrinsic polymorphic phase boundaries effectively with the help of Bi-based perovskite oxide additives. For the KNN composition that derives benefit from the combination of er and d33, the value of g33 was found to be 46.9 ´ 10-3 V·m/N, which is significantly higher than those (20 - 30 ´ 10−3 V·m/N) found in well-known polycrystalline lead-based ceramics including commercial Pb(Zr,Ti)O3 (PZT). Finally, the accelerometer sensor prototype built using the modified KNN composition demonstrated higher voltage sensitivity (183 mV/g) when measuring vibrations, showing a 29% increase against the PZT-based sensor (142 mV/g).


2014 ◽  
Vol 115 (8) ◽  
pp. 084108 ◽  
Author(s):  
Robert Dittmer ◽  
Wook Jo ◽  
Kyle G. Webber ◽  
Jacob L. Jones ◽  
Jürgen Rödel

Author(s):  
Peter Jacob ◽  
Michael Rütsch

Abstract This case study shows a typical example of a manufacturing-chain-induced reliability problem. All participants of the chain do their work within specifications, but, looking at the system level, severe reliability problems have been observed. In order to get back into the system-level process window, several corrective actions are possible. In this case, the most promising approach is an improvement of the stitch bond robustness, combined with a clear user specification.


Author(s):  
Frank Toth ◽  
Gary F. Shade

Abstract Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.


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