Simulating surface tension of Sn-based lead free solder using an artificial neural network

Purpose Because of the complexity of relationship between surface tension and its decisive factors, such as temperature, concentration, electronic density, molar atomic volume and electro-negativity, a reasonable predicting model of surface tension of Sn-based solder alloys has not been developed yet. The paper aims to address the surface tension issue that has to be considered if the new lead free solder will be applied for electronics. Design/methodology/approach Using an artificial neural network (ANN) model with back-propagation (BP) algorithm, the surface tension for Sn-based binary solder alloys was simulated, and the comparison between the simulating results and data from experiments and literatures was analyzed as well. In addition, the relationship between surface tension and its decisive factors would be discussed based on the ANN and orthogonal design methods. Findings It is shown that the predicting model of surface tension of Sn-based solder alloys is constructed according to the BP–ANN theory, and the predicted value from the BP–ANN is in excellent agreement with the experimental results. The surface tension of Sn-based solders is determined by five factors, i.e. temperature, concentration, electronic density, molar atomic volume and electro-negativity. Among of the factors, molar atomic volume is major factor, and the order of degree of influence on surface tension is molar atomic volume > electro-negativity > electronic > density > concentration > temperature. Moreover, a simply reasonable equation is proposed to estimate the surface tension for Sn-based solders. Originality/value The five decisive factors of surface tension for Sn-based binary solder alloys have been analyzed theoretically, and a reasonable model of surface tension for Sn-based binary solder alloys is proposed as well. It is shown that ANN theory will be applied well to simulate the surface tension of Sn-based lead free solder.

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Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

Soldering & Surface Mount Technology ◽

10.1108/ssmt-05-2020-0023 ◽

2020 ◽

Vol ahead-of-print (ahead-of-print) ◽

Author(s):

Guang Ren ◽

Maurice Collins

Keyword(s):

Low Temperature ◽

Solder Alloy ◽

Creep Behaviour ◽

Lead Free ◽

Coefficient Of Determination ◽

Secondary Creep ◽

Lead Free Solder ◽

Solder Alloys ◽

Content Type ◽

Free Solder

Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep tests under stresses of 20–40 MPa and temperature range 25°C–75 °C. Dorn power law and Garofalo hyperbolic sine law were used to model the secondary creep rate. Findings High coefficient of determination R2 of 0.99 is achieved for both the models. It was found that the activation energy of Sn–8Zn–3Bi solder alloy can be significantly increased with addition of Sb, by 60% to 90 kJ/mol approximately, whereas the secondary creep exponent falls in the range 3–7. Improved creep resistance is attributed to solid solution strengthening introduced by micro-alloying. Creep mechanisms that govern the deformation of these newly developed lead-free solder alloys have also been proposed. Originality/value The findings are expected to fill the gap of knowledge on creep behaviour of these newly developed solder alloys, which are possible alternatives as lead-free interconnecting material in low temperature electronic assembly.

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A review: lead free solder and its wettability properties

Soldering & Surface Mount Technology ◽

10.1108/ssmt-08-2015-0022 ◽

2016 ◽

Vol 28 (3) ◽

pp. 125-132 ◽

Cited By ~ 10

Author(s):

Ervina Efzan Mhd Noor ◽

Nur Faziera Mhd Nasir ◽

Siti Rabiatul Aisya Idris

Keyword(s):

Surface Tension ◽

Contact Angle ◽

Electronic Packaging ◽

Design Methodology ◽

Lead Free ◽

Lead Free Solder ◽

Research Papers ◽

Basic Principles ◽

Content Type ◽

Free Solder

Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. Design/methodology/approach This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder. Findings This paper also reviews on the lead free solder characteristics that focused on its wettability. Originality/value This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

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Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural network

Soldering & Surface Mount Technology ◽

10.1108/ssmt-02-2019-0005 ◽

2020 ◽

Vol 32 (3) ◽

pp. 173-180

Author(s):

Min Wu ◽

Bailin Lv

Keyword(s):

Neural Network ◽

Network Model ◽

Neural Network Model ◽

Bp Neural Network ◽

Lead Free ◽

Lead Free Solder ◽

Content Type ◽

Free Solder ◽

Bp Neural Network Model ◽

Lead Free Solders

Purpose Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the viscosity of the liquid ternary Sn-based lead-free solder and its determinants, a theoretical model for the viscosity of the liquid Sn-based solder alloy has not been proposed. This paper aims to address the viscosity issues that must be considered when developing new lead-free solders. Design/methodology/approach A BP neural network model was established to predict the viscosity of the liquid alloy and the predicted values were compared with the corresponding experimental data in the literature data. At the same time, the BP neural network model is compared with the existing theoretical model. In addition, a mathematical model for estimating the melt viscosity of ternary tin-based lead-free solders was constructed using a polynomial fitting method. Findings A reasonable BP neural network model was established to predict the melt viscosity of ternary tin-based lead-free solders. The viscosity prediction of the BP neural network agrees well with the experimental results. Compared to the Seetharaman and the Moelwyn–Hughes models, the BP neural network model can predict the viscosity of liquid alloys without the need to calculate the relevant thermodynamic parameters. In addition, a simple equation for estimating the melt viscosity of a ternary tin-based lead-free solder has been proposed. Originality/value The study identified nine factors that affect the melt viscosity of ternary tin-based lead-free solders and used these factors as input parameters for BP neural network models. The BP neural network model is more convenient because it does not require the calculation of relevant thermodynamic parameters. In addition, a mathematical model for estimating the viscosity of a ternary Sn-based lead-free solder alloy has been proposed. The overall research shows that the BP neural network model can be well applied to the theoretical study of the viscosity of liquid solder alloys. Using a constructed BP neural network to predict the viscosity of a lead-free solder melt helps to study the liquid physical properties of lead-free solders that are widely used in electronic information.

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A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Soldering & Surface Mount Technology ◽

10.1108/ssmt-11-2018-0046 ◽

2019 ◽

Vol 32 (2) ◽

pp. 115-126 ◽

Cited By ~ 1

Author(s):

Muhammad Aamir ◽

Riaz Muhammad ◽

Majid Tolouei-Rad ◽

Khaled Giasin ◽

Vadim V. Silberschmidt

Keyword(s):

Carbon Nanotubes ◽

Good Alternative ◽

Global Market ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Content Type ◽

Silver Copper ◽

Free Solder ◽

Tin Silver Copper

Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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Temperature and Oxygen Partial Pressure Dependences of the Surface Tension of Liquid Sn–Ag and Sn–Cu Lead-free Solder Alloys

Monatshefte für Chemie - Chemical Monthly ◽

10.1007/s00706-005-0379-7 ◽

2005 ◽

Vol 136 (11) ◽

pp. 1829-1834 ◽

Cited By ~ 5

Author(s):

Joonho Lee ◽

Wataru Shimoda ◽

Toshihiro Tanaka

Keyword(s):

Surface Tension ◽

Oxygen Partial Pressure ◽

Partial Pressure ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Free Solder

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Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

Soldering & Surface Mount Technology ◽

10.1108/ssmt-08-2018-0028 ◽

2019 ◽

Vol 32 (1) ◽

pp. 19-23 ◽

Cited By ~ 3

Author(s):

Ahmet Mustafa Erer ◽

Serkan Oguz

Keyword(s):

Solder Alloy ◽

Sessile Drop ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Content Type ◽

Cu Substrate ◽

Wetting Properties ◽

Free Solder ◽

Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

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