Three dimensional integration of electromagnetic interference filter

Author(s):  
Yu Zhang ◽  
Feng Zheng ◽  
Yuchen Xie ◽  
Yanpeng Qiao ◽  
Genzhai Peng
2017 ◽  
Vol 88 (20) ◽  
pp. 2353-2361 ◽  
Author(s):  
Wei Fan ◽  
Dan-dan Li ◽  
Jia-lu Li ◽  
Juan-zi Li ◽  
Lin-jia Yuan ◽  
...  

To investigate the reinforcement architectures effect on the electromagnetic wave properties of carbon fiber reinforced polymer composites, three-dimensional (3D) interlock woven fabric/epoxy composites, 3D interlock woven fabric with stuffer warp/epoxy composites, and 3D orthogonal woven fabric/epoxy composites were studied by the free-space measurement system. The results showed that the three types of 3D woven carbon fiber fabric/epoxy composites had a slight difference in electromagnetic wave properties and the absorption was their dominant radar absorption mechanism. The electromagnetic wave absorption properties of the three types of composites were more than 90% (below −10 dB) over the 11.2–18 GHz bandwidth, and more than 60% (below −4 dB) over the 8–12 GHz bandwidth. Compared with unidirectional carbon fiber reinforced plastics, the three kinds of 3D woven carbon fiber fabric/epoxy composites exhibited better electromagnetic wave absorption properties over a broadband frequency range of 8–18 GHz. Therefore, the three kinds of 3D woven composite are expected to be used as radar absorption structures due to their excellent mechanical properties and outstanding absorption capacity. The total electromagnetic interference shielding effectiveness of the three types of 3D carbon fiber woven composites are all larger than 46 dB over the 8–12 GHz bandwidth, which is evidence that the three types of 3D carbon fiber woven composites can be used as excellent shielding materials for electromagnetic interference.


2020 ◽  
Vol 8 (34) ◽  
pp. 11748-11759 ◽  
Author(s):  
Jingnan Ni ◽  
Ruoyu Zhan ◽  
Jun Qiu ◽  
Jincheng Fan ◽  
Binbin Dong ◽  
...  

Three-dimensional graphene aerogel/polydimethylsiloxane metacomposites with an integral multi-interface structure possess adjustable negative permittivity, excellent microwave absorption and electromagnetic interference shielding.


NANO ◽  
2020 ◽  
Vol 15 (11) ◽  
pp. 2050143
Author(s):  
Bowen Feng ◽  
Wei Li ◽  
Fei Xue ◽  
Xingyu Tong ◽  
Jiaying Li ◽  
...  

In this work, graphene aerogels (GAs) with three-dimensional interconnected networks were prepared by chemical reduction and self-assembly of graphene oxide sheets. After microwave treatment, obtained microwave reduced graphene aerogels (MRGAs) were used in the preparation of bismaleimide (BMI) composites. The results show that the microwave treatment significantly enhanced the quality of GAs, and the three-dimensional networks in the GAs were well retained. Moreover, the MRGAs were highly efficient in endowing BMI with high electrical conductivity and excellent electromagnetic interference shielding effectiveness (EMI SE). The conductivity of MRGA/BMI composites was 42–68% higher than that of GA/BMI composites. When the filler content is 1.6 wt.%, the EMI SE of MRGA/BMI composite was 32.3% higher than that of GA/BMI composite in the X band.


Author(s):  
Jeremy A. Palmer ◽  
Jeffrey L. Summers ◽  
Donald W. Davis ◽  
Phillip L. Gallegos ◽  
Bart D. Chavez ◽  
...  

Research in rapid prototyping of high-density circuitry (RPHDC) involves integrating direct write (DW) conductive ink dispensing technology with stereolithography (SL) to manufacture smart structural members with integrated three-dimensional electronics. A significant challenge in this effort is realizing practical three-dimensional interconnect for discrete electronic packages encapsulated within a SL matrix. This paper presents research into SL-encapsulated DW three-dimensional interconnect. Results suggest that robust three-dimensional electronics are possible within an integrated DWSL structure. A power supply circuit is demonstrated that converts a 28 VDC input to a 5 VDC output with electromagnetic interference filtering capability. Additional work is necessary to improve resistance of DW interconnect, and planarity of device planes. Strategies for improving resistance of DW ink through localized laser curing and thermal curing are discussed in addition to the encapsulation performance of advanced SL resins. Future work in this area may impact the widely accepted MCM-L and MCM-C multichip module technologies.


Sign in / Sign up

Export Citation Format

Share Document