Tiny Wafer Level Chip Scale Packaged Inductive Components for High Frequency Isolated/Non-Isolated DC-DC Converters

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487348 ◽

2021 ◽

Author(s):

Dragan Dinulovic ◽

Mahmoud Shousha ◽

Martin Haug

Keyword(s):

High Frequency ◽

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A novel wafer-level double side packaging and its high frequency performance

2013 IEEE International Conference on Industrial Technology (ICIT) ◽

10.1109/icit.2013.6505807 ◽

2013 ◽

Author(s):

Xiao Chen ◽

Jiajie Tang ◽

Gaowei Xu ◽

Tie Li ◽

Le Luo

Keyword(s):

High Frequency ◽

Wafer Level ◽

High Frequency Performance

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Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough

Electrical Engineering in Japan ◽

10.1002/eej.23193 ◽

2019 ◽

Vol 206 (2) ◽

pp. 44-53

Author(s):

Masaaki Moriyama ◽

Yukio Suzuki ◽

Kentaro Totsu ◽

Hideki Hirano ◽

Shuji Tanaka

Keyword(s):

High Frequency ◽

Gold Film ◽

Frequency Characteristics ◽

Wafer Level ◽

Packaging Technology ◽

Mems Packaging ◽

Metal Bonding ◽

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Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications

2013 IEEE MTT-S International Microwave Symposium Digest (MTT) ◽

10.1109/mwsym.2013.6697745 ◽

2013 ◽

Author(s):

Maciej Wojnowski ◽

Klaus Pressel

Keyword(s):

High Frequency ◽

Ball Grid Array ◽

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New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2019.2944601 ◽

2019 ◽

Vol 67 (12) ◽

pp. 4674-4681

Author(s):

Donghun Lee ◽

Joonhyun Kim ◽

Yungseon Eo

Keyword(s):

Transmission Lines ◽

High Frequency ◽

Wafer Level ◽

Coupled Transmission Lines

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A compact circuit for wafer-level monitoring of operational amplifier high-frequency performance using DC parametric test equipment

2012 IEEE International Conference on Microelectronic Test Structures ◽

10.1109/icmts.2012.6190633 ◽

2012 ◽

Author(s):

Z. G. Sparling ◽

Vance C. Tyree ◽

Nathan Cox ◽

P. Thomas Vernier

Keyword(s):

Operational Amplifier ◽

High Frequency ◽

Test Equipment ◽

Wafer Level ◽

Parametric Test ◽

Level Monitoring ◽

High Frequency Performance

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Process development of a novel wafer level packaging with TSV applied in high-frequency range transmission

Microsystem Technologies ◽

10.1007/s00542-012-1712-9 ◽

2012 ◽

Vol 19 (4) ◽

pp. 483-491 ◽

Author(s):

Xiao Chen ◽

Jiajie Tang ◽

Gaowei Xu ◽

Le Luo

Keyword(s):

High Frequency ◽

Process Development ◽

High Frequency Range ◽

Frequency Range ◽

Wafer Level ◽

Wafer Level Packaging

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Comparative analysis of high-frequency transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507059 ◽

2012 ◽

Author(s):

E. Seler ◽

M. Wojnowski ◽

G. Sommer ◽

R. Weigel

Keyword(s):

Comparative Analysis ◽

High Frequency ◽

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High-frequency Test Structures For Wafer-level Reliability

10.1109/iwlr.1992.657989 ◽

1992 ◽

Author(s):

E.S. Snyder ◽

D.V. Campbell ◽

S.E. Swanson

Keyword(s):

High Frequency ◽

Wafer Level ◽

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High Frequency Characterization of 100 Micron Pitch Wafer Level Package Interconnects

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614389 ◽

2006 ◽

Author(s):

J. Jayabalan ◽

M.D. Rotaru

Keyword(s):

High Frequency ◽

Wafer Level ◽

Wafer Level Package

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High Frequency Characterization of Thin-Film Redistribution Layers for Embedded Wafer Level BGA

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469826 ◽

2007 ◽

Author(s):

M. Wojnowski ◽

M. Engl ◽

M. Brunnbauer ◽

K. Pressel ◽

G. Sommer ◽

...

Keyword(s):

Thin Film ◽

High Frequency ◽

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