2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

152

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467345521, 9781467345538, 9781467345514

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Plasma etching process of AIN/Mo and Moly for CMOS compatible MEMS devices

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507182 ◽

2012 ◽

Author(s):

Wei Deng ◽

J. S. B. W. T. de xian

Keyword(s):

Plasma Etching ◽

Etching Process ◽

Mems Devices ◽

Plasma Etching Process ◽

Cmos Compatible

Download Full-text

Capturing interface toughness parameters from shear testing using different fracture mechanics approaches

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507129 ◽

2012 ◽

Cited By ~ 3

Author(s):

J. Auersperg ◽

R. Dudek ◽

B. Bramer ◽

R. Pufall ◽

B. Seiler ◽

...

Keyword(s):

Fracture Mechanics ◽

Shear Testing ◽

Interface Toughness

Download Full-text

Center Gate Molding challenges and improvements for cavity down TBGA packages

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507040 ◽

2012 ◽

Author(s):

K. Muniandy ◽

S. T. S. Hian ◽

Teng Seng Kiong

Download Full-text

Fatigue failure processes in Pb-free solder joints using continuum damage and cohesive zone models

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507127 ◽

2012 ◽

Cited By ~ 1

Author(s):

N. M. Shaffiar ◽

A. F. M. Yamin ◽

W. K. Loh ◽

M. N. Tamin

Keyword(s):

Fatigue Failure ◽

Cohesive Zone ◽

Solder Joints ◽

Continuum Damage ◽

Cohesive Zone Models ◽

Free Solder

Download Full-text

GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507148 ◽

2012 ◽

Author(s):

Yong Jiun Lee ◽

Boon Long Lau ◽

Yoke Choy Leong ◽

Kok Fah Choo ◽

Xiaowu Zhang ◽

...

Keyword(s):

Thermal Management ◽

Heat Sink ◽

Microchannel Heat Sink ◽

Gan On Si

Download Full-text

Fine pitch Cu pillar wafer process development and seed layer etching characterization

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507185 ◽

2012 ◽

Cited By ~ 1

Author(s):

Li Yan Siow ◽

Wei Deng ◽

Qing Xin Zhang ◽

Tai Chong Chai ◽

Chee Guan Koh ◽

...

Keyword(s):

Seed Layer ◽

Process Development ◽

Cu Pillar ◽

Fine Pitch

Download Full-text

Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507122 ◽

2012 ◽

Cited By ~ 7

Author(s):

F. Kuechenmeister ◽

D. Breuer ◽

H. Geisler ◽

J. Paul ◽

C. Shah ◽

...

Keyword(s):

Flip Chip ◽

Mechanical Stability

Download Full-text

Stacking of known good rebuilt wafers with Through Polymer Via based 3D interconnect application to high speed DDR3

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507121 ◽

2012 ◽

Author(s):

B. J. Noiray ◽

C. Val ◽

P. Couderc

Keyword(s):

High Speed

Download Full-text

Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507139 ◽

2012 ◽

Cited By ~ 2

Author(s):

Xiangmeng Jing ◽

Daquan Yu ◽

Lixi Wan

Keyword(s):

High Resolution ◽

Non Destructive Testing ◽

Destructive Testing ◽

Through Silicon Vias ◽

X Ray ◽

Silicon Vias ◽

Non Destructive

Download Full-text

Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507146 ◽

2012 ◽

Author(s):

X. C. Shan ◽

M. B. Mohahidin ◽

A. C. W. Lu

Keyword(s):

Polymer Films ◽

Hot Embossing ◽

Roll To Roll

Download Full-text

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Plasma etching process of AIN/Mo and Moly for CMOS compatible MEMS devices

Capturing interface toughness parameters from shear testing using different fracture mechanics approaches

Center Gate Molding challenges and improvements for cavity down TBGA packages

Fatigue failure processes in Pb-free solder joints using continuum damage and cohesive zone models

GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink

Fine pitch Cu pillar wafer process development and seed layer etching characterization

Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

Stacking of known good rebuilt wafers with Through Polymer Via based 3D interconnect application to high speed DDR3

Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques

Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Latest Publications