Investigation on characteristic impedance of transmission line in meshed-ground flexible printed circuit

2017 ◽  
Author(s):  
Yantao Zhu ◽  
Fengchao Xiao ◽  
Xiangyang Sun ◽  
Yoshiki Kayano ◽  
Yoshio Kami
Keyword(s):  
Transmission Line ◽  
Characteristic Impedance ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Study of Effects of Differential via on Signal Integrity

2013 ◽  
Vol 805-806 ◽  
pp. 1011-1016
Author(s):  
Da Long Wang ◽  
Zheng Bin Wu ◽  
Jian Wang
Keyword(s):  
Transmission Line ◽  
High Speed ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
Impedance Matching ◽  
Characteristic Impedance ◽  
Circuit Board ◽  
Printed Circuit ◽  
Differential Pair ◽  
Signal Path

If characteristic impedance along a transmission line mismatch on a printed circuit board, high-speed signal has serious signal integrity problems. When signal path of a differential pair jumps layers, mismatched impedance between differential via and differential line will affect the signal integrity. The models of a coupled transmission line and via are presented in this paper. Impedance matching of the coupled transmission line and differential via for differential signals is studied. The effects of differential via dimensions on differential signals is simulated and analyzed.

scholarly journals Flexible Printed Circuit Board as Novel Electrodes for Acoustofluidic Devices

2020 ◽  
pp. 1-6
Author(s):  
Chao Sun ◽  
Roman Mikhaylov ◽  
Yongqing Fu ◽  
Fangda Wu ◽  
Hanlin Wang ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Optimized Positional Compensation Parameters for Exposure Machine for Flexible Printed Circuit Board

2015 ◽  
Vol 11 (6) ◽  
pp. 1366-1377 ◽  
Author(s):  
Jinn-Tsong Tsai ◽  
Chorng-Tyan Lin ◽  
Cheng-Chung Chang ◽  
Jyh-Horng Chou
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

2009 ◽  
Vol 85 (6) ◽  
pp. 341-350 ◽  
Author(s):  
Jong-Bum Lee ◽  
Ja-Myeong Koo ◽  
Jong-Woong Kim ◽  
Bo-In Noh ◽  
Jong-Gun Lee ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Ultrasonic Bonding ◽  
Conductive Film ◽  
Flexible Printed Circuit
Sign in / Sign up

Export Citation Format

Share Document