Experimental Study on Heat Transfer Performance of Elliptical Loop Heat Pipe

Author(s):  
Guoqiang Wu ◽  
Xiang Gou ◽  
Bo Li
2012 ◽  
Vol 197 ◽  
pp. 216-220
Author(s):  
Zhong Chao Zhao ◽  
Rui Ye ◽  
Gen Ming Zhou

To solve the cooling problem in modern electronic device, a kind of heat pipe radiator was designed and manufactured in this paper. The heat transfer performance of heat pipe radiator and its relationship with air velocity were investigated by experimental method. The experimental results show that the heat pipe radiator can meet the temperature requirement of electronic device with the power range from 40W to 160W. To keep the operational temperature of electronic device with power of 160W under 75°C,the air velocity should be keep at 1.7m/s. The heat dissipation performance of heat pipe radiator was enhanced with the air velocity increased from 0.2m/s to 1.7m/s.for the electronic equipment with power of 160W.


2014 ◽  
Vol 595 ◽  
pp. 24-29 ◽  
Author(s):  
Shen Chun Wu ◽  
Kuei Chi Lo ◽  
Jia Ruei Chen ◽  
Chen Yu Chung ◽  
Weie Jhih Lin ◽  
...  

This paper specifically addresses the effect of the sintering temperature curve in manufacturing nickel powder capillary structure (wick) for a loop heat pipe (LHP) with flat evaporator. The sintering temperature curve is composed of three regions: a region of increasing temperature, a region of constant temperature, and a region of decreasing temperature. The most important region is the increasing temperature region, as the rate of temperature increase directly affects the performance of the wick.When the slope of the region of increasing temperature is 0.8 (equivalent to 8 OC/min), the structure of the manufactured wick is complete, with the best heat transfer performance result. Experimental resultsshowed that the optimal heat transfer performance is 160W, the minimal total thermal resistance is approximately 0.43OC/W, and the heat flux is 17W/cm2; the optimal wick manufactured has an effective pore radius of 5.2 μm, a permeability of 5.9×10-13m2, and a porosity of 64%.


2019 ◽  
Vol 158 ◽  
pp. 5629-5634
Author(s):  
Pei-pei Zhang ◽  
Jia-ling Zhu ◽  
Ni-ni Chang ◽  
An-da Song ◽  
Yu-jiao Lei ◽  
...  

2013 ◽  
Vol 711 ◽  
pp. 223-228 ◽  
Author(s):  
Shen Chun Wu ◽  
Jhih Huang Gao ◽  
Zih Yan Huang ◽  
Dawn Wang ◽  
Cho Jeng Huang ◽  
...  

This study investigates the effects of increasing the evaporating area of wick in a loop heat pipe (LHP). This work attempts to improve the performance of the loop heat pipe by increasing the number of grooves and thereby the surface area of the wick. The number of grooves is increased from eight to twelve. Experimental results show that increasing the number of grooves not only increases the surface area of the wick but also enhances LHP performance. When the evaporating surface area increases by 50%, which corresponds to increasing the number of grooves from eight to twelve, the heat transfer capacity increases from 310W to 470W and the thermal resistance is reduced from 0.21°C/W to 0.17°C/W. According to preliminary measurements, increasing the number of grooves in the loop heat pipe is highly promising for improving the heat transfer performance.


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