Lithography technology and trends for advanced packaging

2016 ◽  
Author(s):  
Amandine Pizzagalli
Keyword(s):  
Advanced Packaging ◽  
Lithography Technology

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

scholarly journals A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level

2009 ◽  
Vol 1 (1) ◽  
pp. 1527-1530
Author(s):  
S. Maus ◽  
U. Hansen ◽  
J. Leib ◽  
M. Töpper
Keyword(s):  
Optical Devices ◽  
Wafer Level ◽  
Advanced Packaging
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