Characterization of Al wire wedge bonding in power electronics package

2012 ◽  
Author(s):  
Yumin Liu ◽  
Yong Liu ◽  
Daren Keller ◽  
Suresh Belani ◽  
Michael Dube
Keyword(s):  
Power Electronics ◽  
Wedge Bonding

Implementation and validation of a new thermal model for analysis, design, and characterization of multichip power electronics devices

1999 ◽  
Vol 35 (3) ◽  
pp. 663-669 ◽  
Author(s):  
F. Profumo ◽  
A. Tenconi ◽  
S. Faceili ◽  
B. Passerini
Keyword(s):  
Power Electronics ◽  
Thermal Model ◽  
Analysis Design

Conducted and radiated EMI characterization of power electronics converter

1999 ◽  
Vol 20 (6-7) ◽  
pp. 488
Author(s):  
Moez Youssef ◽  
Giulio Antonini ◽  
Edith Clavel ◽  
James Roudet ◽  
S. Cristina ◽  
...  
Keyword(s):  
Power Electronics ◽  
Power Electronics Converter

scholarly journals Study of Copper–Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

Materials ◽  
2021 ◽  
Vol 14 (22) ◽  
pp. 7039
Author(s):  
Jiri Hlina ◽  
Jan Reboun ◽  
Ales Hamacek
Keyword(s):  
Power Electronics ◽  
Nickel Nanoparticles ◽  
Nickel Content ◽  
Nitrogen Atmosphere ◽  
Copper Films ◽  
Electrical Parameters ◽  
Nickel Nanoparticle ◽  
Copper Nickel ◽  
Copper Nickel Alloy

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 Ω/square and low temperature coefficient of resistance ±100·10−6 K−1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

scholarly journals High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

2021 ◽  
pp. 105168
Author(s):  
Jiajie Fan ◽  
Dawei Jiang ◽  
Hao Zhang ◽  
Dong Hu ◽  
Xu Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
High Power ◽  
Electronics Packaging ◽  
Copper Particles

Preparation and mechanical characterization of Ni-Fe-P coating for power electronics

2018 ◽  
Author(s):  
Zhiwen Chen ◽  
Fan Yang ◽  
Hao Zheng ◽  
Juan Peng ◽  
Sheng Liu ◽  
...  
Keyword(s):  
Power Electronics ◽  
Mechanical Characterization
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