Controlling the Conduction Mechanisms in Isotropic Conductive Adhesives with Silver-Coated Polymer Spheres

2016 ◽  
Author(s):  
Sigurd R. Pettersen ◽  
Helge Kristiansen ◽  
Keith Redford ◽  
Susanne Helland ◽  
Erik Kalland ◽  
...  
Keyword(s):  
Conductive Adhesives ◽  
Conduction Mechanisms ◽  
Isotropic Conductive Adhesives ◽  
Polymer Spheres

scholarly journals Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives

2016 ◽  
Vol 133 (31) ◽  
Author(s):  
Hoang-Vu Nguyen ◽  
Jianying He ◽  
Tore Helland ◽  
Helge Kristiansen ◽  
Knut E. Aasmundtveit
Keyword(s):  
Electrical Characterization ◽  
Conductive Adhesives ◽  
Individual Metal ◽  
Isotropic Conductive Adhesives ◽  
Polymer Spheres

An Overview of Isotropic Conductive Adhesives Filled with Metal-coated Polymer Spheres

2013 ◽  
Vol 2013 (1) ◽  
pp. 000200-000207
Author(s):  
Hoang-Vu Nguyen ◽  
Knut E. Aasmundtveit ◽  
Helge Kristiansen ◽  
Tore Helland
Keyword(s):  
Mechanical Performance ◽  
Mechanical Vibration ◽  
Mechanical Shock ◽  
Conductive Adhesives ◽  
Electronic Products ◽  
Ag Particles ◽  
Isotropic Conductive Adhesives ◽  
Good Potential ◽  
Characterization Studies ◽  
Polymer Spheres

Novel isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) have been introduced in order to improve the mechanical performance, and hence the reliability, compared to conventional ICAs filled with solid silver (Ag) particles. This paper summarizes a number of characterization studies on the electrical, the mechanical and the rheological properties, as well as a study on the reliability, of MPS-based ICAs. The feasibility of the ICAs filled with MPS has been demonstrated in terms of potential processing capabilities, improved mechanical performance and competitive electrical properties (compared to conventional ICAs with Ag flakes). Therefore, the MPS-based ICAs have a good potential for demanding environment applications, in which electronic products (e.g., hand held devices) are subjected to thermal shock and thermal cycling, mechanical vibration and mechanical shock.

Numerical analysis of polymer cure kinetics in isotropic conductive adhesives

2010 ◽  
Author(s):  
T. Tilford ◽  
J. E. Morris ◽  
M. Ferenets ◽  
P. R. Rajaguru ◽  
S. Pavuluri ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Cure Kinetics ◽  
Conductive Adhesives ◽  
Isotropic Conductive Adhesives

Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives

2011 ◽  
Vol 105 (1) ◽  
pp. 151-155 ◽  
Author(s):  
R. Durairaj ◽  
Lam Wai Man
Keyword(s):  
Conductive Adhesives ◽  
Isotropic Conductive Adhesives
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