Flexible Two-layered Photo-Imageable Dielectric and its Application to Thin Form-Factor and High-Density FPC (Flexible Printed Circuit) using SAP (Semi-Additive Processes)

2021 ◽  
Author(s):  
Shuhei Takashima ◽  
Yuto Odagiri ◽  
Kazuyoshi Yoneda ◽  
Tadahiko Hanada
Keyword(s):  
Form Factor ◽  
High Density ◽  
Printed Circuit ◽  
Additive Processes ◽  
Flexible Printed Circuit

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

2018 ◽  
Vol 193 (3-4) ◽  
pp. 578-584 ◽  
Author(s):  
Xavier de la Broïse ◽  
Alain Le Coguie ◽  
Jean-Luc Sauvageot ◽  
Claude Pigot ◽  
Xavier Coppolani ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Printed Circuit Board ◽  
High Density ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
High Thermal Resistance ◽  
Very High

scholarly journals Fine Lines in a Three Dimensional Interconnect

1984 ◽  
Vol 11 (2) ◽  
pp. 109-115
Author(s):  
J. A. Scarlett
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Three Dimensional ◽  
High Density ◽  
Circuit Boards ◽  
Fine Line ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Planar Substrates

The techniques for the generation of fine lines on rigid and flexible printed circuit boards are reviewed, and it is shown how the tracking on the interconnect can be made to match the requirements of chip carriers, TAB chips or beam leaded or wire bonded chips directly mounted.The use of fine line techniques on planar substrates can be adapted to provide a low cost, high density interconnect which offers a truly three dimensional connection capability without the use of a “back wiring panel”. Such a three dimensional interconnect can offer opportunities for improvement in the removal of heat from high dissipation chips, thus offering significantly increased reliability.

scholarly journals Flexible Printed Circuit Board as Novel Electrodes for Acoustofluidic Devices

2020 ◽  
pp. 1-6
Author(s):  
Chao Sun ◽  
Roman Mikhaylov ◽  
Yongqing Fu ◽  
Fangda Wu ◽  
Hanlin Wang ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Optimized Positional Compensation Parameters for Exposure Machine for Flexible Printed Circuit Board

2015 ◽  
Vol 11 (6) ◽  
pp. 1366-1377 ◽  
Author(s):  
Jinn-Tsong Tsai ◽  
Chorng-Tyan Lin ◽  
Cheng-Chung Chang ◽  
Jyh-Horng Chou
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit
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