Study on an Artificial Intelligence Based Kernel Ridge Regression Algorithm for Wafer Level Package Reliability Prediction

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00229 ◽

2021 ◽

Author(s):

Sunil Kumar Panigrahy ◽

Kuo-Ning Chiang

Keyword(s):

Artificial Intelligence ◽

Ridge Regression ◽

Reliability Prediction ◽

Wafer Level ◽

Kernel Ridge Regression ◽

Wafer Level Package ◽

Package Reliability

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Design optimization for wafer level package reliability by using artificial neural network

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706665 ◽

2013 ◽

Author(s):

P.-C. Lai ◽

T.-C. Chiu ◽

G. S. Shen

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Design Optimization ◽

Wafer Level ◽

Artificial Neural ◽

Wafer Level Package ◽

Package Reliability

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Review for "Islanding and power quality disturbance monitoring in microgrid using adaptive cross variational mode decomposition and reduced kernel ridge regression"

10.1002/2050-7038.12364/v2/review1 ◽

2020 ◽

Author(s):

Muhammad Adil

Keyword(s):

Power Quality ◽

Ridge Regression ◽

Variational Mode Decomposition ◽

Kernel Ridge Regression ◽

Mode Decomposition ◽

Power Quality Disturbance

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Review for "Islanding and power quality disturbance monitoring in microgrid using adaptive cross variational mode decomposition and reduced kernel ridge regression"

10.1002/2050-7038.12364/v1/review2 ◽

2019 ◽

Keyword(s):

Power Quality ◽

Ridge Regression ◽

Variational Mode Decomposition ◽

Kernel Ridge Regression ◽

Mode Decomposition ◽

Power Quality Disturbance

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Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202920 ◽

2020 ◽

Author(s):

Zuohuan Chen ◽

Mingchuan Zhang ◽

Kai Zhu ◽

Feng Jiang ◽

Daquan Yu

Keyword(s):

Thin Film ◽

Wafer Level ◽

Wafer Level Package

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Development on integrated passive devices using wafer level package technologies

2010 12th Electronics Packaging Technology Conference ◽

10.1109/eptc.2010.5702727 ◽

2010 ◽

Author(s):

Byeung-Gee Kim ◽

Yun-Mook Park ◽

Jun-Kyu Lee ◽

In-Soo Kang

Keyword(s):

Wafer Level ◽

Passive Devices ◽

Wafer Level Package

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Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430583 ◽

2006 ◽

Author(s):

Shan Gao ◽

Jupyo Hong ◽

Taehoon Kim ◽

Seogmoon Choi ◽

Sung Yi

Keyword(s):

Acoustic Wave ◽

Surface Acoustic Wave ◽

Wafer Level ◽

Wafer Level Package

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Experimental evaluation and development of predictive models for rheological behavior of aqueous Fe3O4 ferrofluid in the presence of an external magnetic field by introducing a novel grid optimization based-Kernel ridge regression supported by sensitivity analysis

Powder Technology ◽

10.1016/j.powtec.2021.07.037 ◽

2021 ◽

Author(s):

Amin Shahsavar ◽

Mehdi Jamei ◽

Masoud Karbasi

Keyword(s):

Magnetic Field ◽

Sensitivity Analysis ◽

External Magnetic Field ◽

Rheological Behavior ◽

Predictive Models ◽

Ridge Regression ◽

Experimental Evaluation ◽

Kernel Ridge Regression ◽

Grid Optimization

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Warpage characteristics of wafer-level package of MEMS with glass frit bonding

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756603 ◽

2013 ◽

Author(s):

Gaowei Xu ◽

Shuangfu Wang ◽

Chunsheng Zhu ◽

Jiaotuo Ye ◽

Wei Gai ◽

...

Keyword(s):

Wafer Level ◽

Wafer Level Package

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A new wafer level package for improved electrical and reliability performance

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225893 ◽

2004 ◽

Author(s):

S. Barrett ◽

J. Reche ◽

Deok-Hoon Kim ◽

D. Stepniak

Keyword(s):

Wafer Level ◽

Reliability Performance ◽

Wafer Level Package

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A novel wafer level package strategy for RF MEMS

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270766 ◽

2009 ◽

Author(s):

Zheng Wang ◽

Zewen Liu

Keyword(s):

Rf Mems ◽

Wafer Level ◽

Wafer Level Package

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