Mapping of solder mask covered interconnects on high density printed circuit board

Author(s):  
Cher Tan ◽  
Yan Tay ◽  
Chun Goh ◽  
Tai Chai
2018 ◽  
Vol 193 (3-4) ◽  
pp. 578-584 ◽  
Author(s):  
Xavier de la Broïse ◽  
Alain Le Coguie ◽  
Jean-Luc Sauvageot ◽  
Claude Pigot ◽  
Xavier Coppolani ◽  
...  

1999 ◽  
Vol 39 (9) ◽  
pp. 1337-1341 ◽  
Author(s):  
S. Zhang ◽  
J. De Baets ◽  
A. Van Calster

Author(s):  
Carl Nail ◽  
Larry Rice

Abstract A PCB trace was repeatedly cracking in the same location. Visual inspection showed cracking there and at structurally similar locations, with solder mask missing from one side of the trace of interest. Fracture analysis suggested that these issues and etch pitting caused crack initiation, followed by fatigue failure that ultimately led to full fracture. A FIB section of a second failure reinforced the finding that the fundamental cracking mechanism was fatigue.


1992 ◽  
Vol 15 (4) ◽  
pp. 418-425 ◽  
Author(s):  
A. Takahashi ◽  
N. Ooki ◽  
A. Nagai ◽  
H. Akahoshi ◽  
A. Mukoh ◽  
...  

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