Signal Integrity analysis for high speed channels in pcb/package co-design interface: 3D full wave vs. 2d/hybrid approach & full model vs. segmentation approach
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2004 ◽
Vol 27
(1)
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pp. 213-223
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2014 ◽
Vol 548-549
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pp. 754-759
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2012 ◽
Vol 23
(5)
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pp. 586-597
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2004 ◽
Vol 27
(4)
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pp. 611-629
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2018 ◽
Vol 60
(6)
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pp. 1957-1964
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2015 ◽
Vol 57
(5)
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pp. 1226-1234
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2011 ◽
Vol 59
(2)
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pp. 230-241
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