RADIATION AND SIGNAL INTEGRITY ANALYSIS IN IMPERFECTLY DIFFERENTIAL TRANSMISSION LINES WITH FULL-WAVE FDTD METHOD

2002 ◽  
Author(s):  
WEILIANG YUAN ◽  
ERPING LI
Keyword(s):  
Transmission Lines ◽  
Signal Integrity ◽  
Fdtd Method ◽  
Full Wave ◽  
Differential Transmission ◽  
Integrity Analysis

Signal Integrity Analysis of High-Speed Signal Connector USB3.0

2013 ◽  
Vol 760-762 ◽  
pp. 320-324
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang
Keyword(s):  
Transmission Lines ◽  
High Speed ◽  
Signal Integrity ◽  
Signal Transmission ◽  
Simulation Software ◽  
Key Factor ◽  
Transmission Quality ◽  
Integrity Analysis ◽  
Relationship Of ◽  
The Relationship

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.

A Survey on FDTD-Based Interconnect Modeling

2014 ◽  
Vol 24 (01) ◽  
pp. 1530001 ◽  
Author(s):  
N. S. Murthy ◽  
M. Kavicharan
Keyword(s):  
Signal Integrity ◽  
Fdtd Method ◽  
Research Activity ◽  
Activity Tracking ◽  
Related Research ◽  
The Past ◽  
Lumped Elements ◽  
Interconnect Modeling ◽  
Integrity Analysis ◽  
Difference Time

This paper presents a selective survey of finite difference time domain (FDTD)-based interconnects modeling for signal integrity analysis problems. In spite of 47 years of its existence, researchers have focused on FDTD method with further modifications and enhancements for the signal integrity analysis of interconnects over the past two decades only. Because of the remarkable amount of interconnect-based FDTD-related research activity, tracking the FDTD literature can be a tedious and challenging task. This survey presents some of the significant methods and approaches employed to analyze the developments achieved up to the present-day signal integrity related research. These methods are based on solving telegrapher's equations which represent the transmission line behavior of interconnects. Recent research concentrates on developing novel methods for accurate interconnect modeling, extraction of interconnect parameters and incorporation of more lumped elements into FDTD. In this paper an attempt has been made to compare and summarize some of the well-known FDTD-based methods, which were used in interconnect related research.

Signal Integrity Analysis of High-Speed Differential Vias

2014 ◽  
Vol 548-549 ◽  
pp. 754-759 ◽  
Author(s):  
Ling Bao Zhao ◽  
Qing Hua Chen
Keyword(s):  
High Speed ◽  
Signal Integrity ◽  
Data Rate ◽  
Electronic Systems ◽  
Impedance Mismatch ◽  
Package Design ◽  
Paper Detail ◽  
Full Wave ◽  
Integrity Analysis

In modern electronic systems, data rate is keeping increase, and Gbps becomes common, designing for reliable signal integrity becomes more and more important. In the high speed borad/package design, discontinuities are big concerns of signal integrity. A variety of sources lead to discontinuities and every source ought to be carefully treated. The signal via is one source of discontinuity that should not be overlooked. Vias can add jitter and reduce eye openings that can cause data misinterpretation by the receiver. This paper detail the antipad, pad and excess via stub effect on the vias. In each case, the impedance mismatch at the via transition can be minimized by optimizing a few parameters such as antipad radius, pad radius and excess via stub. The impacts of these parameters are investigated with the help for a full-wave 3D electromagnetic simulator.

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