Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components

2020 ◽  
Author(s):  
J. Zundel ◽  
T. Krivec ◽  
Q. Tao ◽  
M. Frewein ◽  
S. Stojanovic
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Electrical Components

Pyrolysis Characteristics and Recovery of the Metallic and Nonmetallic Materials in Wasted Printed Circuit Boards

2011 ◽  
Vol 347-353 ◽  
pp. 2107-2111
Author(s):  
Hong Ting Ma ◽  
Guo Li Yang ◽  
Su Feng Hao
Keyword(s):  
Weight Loss ◽  
Heating Rate ◽  
Printed Circuit Boards ◽  
Pyrolysis Temperature ◽  
Fixed Bed ◽  
Fixed Bed Reactor ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Pyrolysis Characteristics ◽  
Electrical Components

A typical printed circuit boards (PCBs) has been investigated by using thermo-gravimetric analyser to study its pyrolysis characteristics, the results indicate that the maximum weight loss rate occurs at temperature between 320°C and 360°C. A higher heating rate results in higher initial, final, peak temperature, and a longer process of significant weight loss. At the same pyrolysis temperature, heating rate has little effect on the total weight loss. In addition, 1kg PCBs based FR-4 was pyrolyzed in a fixed-bed reactor. The pyrolysis residues are very friable, the organic, glass fiber and metallic fractions can easily be separated, and the electrical components can easily be removed from the remains. Considering energy-saving, better control and design of the pyrolysis process, the optimal pyrolysis parameters were suggested at heating rate 10°C/min, final pyrolysis temperature 500°C and holding time 30 min.

Integration of a Reliability Model Within a Virtual Analysis System for Printed Circuit Boards

2013 ◽  
Author(s):  
Benjamin B. Goerdt ◽  
Amer Dababneh ◽  
Timothy Marler ◽  
Ibrahim Ozbolat ◽  
Benjamin Weibtraub ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Board ◽  
Reliability Model ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Simulation Based ◽  
Analysis System ◽  
User Friendly ◽  
Electrical Components ◽  
Concurrent Analysis

The field of modeling and simulation continues to grow and help reduce costs and increase development speed in the engineering community, but use of such capabilities has been minimal with respect to circuit board visualization and reliability. This work responds to this gap with a new simulation-based reliability model for electrical components and systems, integrated within a software platform for concurrent analysis. While statistics-based reliability analysis is common, this work presents the integration of such models in a comprehensive system. The results coupled with a user-friendly interface and display in a virtual environment combine to create a novel tool for the identification of problem areas and planning for future maintenance of electromechanical systems.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

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