Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICs

2012 19th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2012) ◽

10.1109/icecs.2012.6463647 ◽

2012 ◽

Cited By ~ 2

Author(s):

Khaled Salah

Keyword(s):

Coupling Capacitance ◽

3D Ics ◽

Metal Interconnects

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Coupling Capacitance Extraction between TSVs in 3D ICs Using Inverse of Inductance Matrix

IEEJ Transactions on Electronics Information and Systems ◽

10.1541/ieejeiss.135.744 ◽

2015 ◽

Vol 135 (7) ◽

pp. 744-751

Author(s):

Tetsuya Kobayashi ◽

Nanako Niioka ◽

Masa-aki Fukase ◽

Atsushi Kurokawa

Keyword(s):

Capacitance Extraction ◽

Coupling Capacitance ◽

3D Ics

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Coupling capacitance in face-to-face (F2F) bonded 3D ICs: Trends and implications

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159641 ◽

2015 ◽

Cited By ~ 1

Author(s):

Taigon Song ◽

Arthur Nieuwoudt ◽

Yun Seop Yu ◽

Sung Kyu Lim

Keyword(s):

Face To Face ◽

Coupling Capacitance ◽

3D Ics

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A TSV to TSV, A TSV to Metal interconnects, and A TSV to active device coupling capacitance: Analysis and recommendations

2015 10th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) ◽

10.1109/dtis.2015.7127343 ◽

2015 ◽

Cited By ~ 2

Author(s):

Khaled Salah

Keyword(s):

Active Device ◽

Coupling Capacitance ◽

Metal Interconnects

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Chip layer assignment method for analytical placement of 3D ICs

Journal of Computer Applications ◽

10.3724/sp.j.1087.2013.01548 ◽

2013 ◽

Vol 33 (6) ◽

pp. 1548-1552

Author(s):

Wenchao GAO ◽

Qiang ZHOU ◽

Xu QIAN ◽

Yici CAI

Keyword(s):

Assignment Method ◽

3D Ics ◽

Layer Assignment

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Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231583 ◽

2012 ◽

Cited By ~ 6

Author(s):

H. Oprins ◽

V. Cherman ◽

K. Rebibis ◽

K. Vermeersch ◽

C. Gerets ◽

...

Keyword(s):

Transient Analysis ◽

Thermal Characterization ◽

3D Ics

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Hexagonal Boron Nitride: Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer (Adv. Electron. Mater. 6/2021)

Advanced Electronic Materials ◽

10.1002/aelm.202170020 ◽

2021 ◽

Vol 7 (6) ◽

pp. 2170020

Author(s):

Yunjo Jeong ◽

Ossie Douglas ◽

Utkarsh Misra ◽

Md Rubayat‐E Tanjil ◽

Kenji Watanabe ◽

...

Keyword(s):

Boron Nitride ◽

Hexagonal Boron Nitride ◽

Passivation Layer ◽

Metal Interconnects

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Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer

Advanced Electronic Materials ◽

10.1002/aelm.202100002 ◽

2021 ◽

pp. 2100002

Author(s):

Yunjo Jeong ◽

Ossie Douglas ◽

Utkarsh Misra ◽

Md Rubayat‐E Tanjil ◽

Kenji Watanabe ◽

...

Keyword(s):

Boron Nitride ◽

Hexagonal Boron Nitride ◽

Passivation Layer ◽

Metal Interconnects

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Fabrication and Characterization of 3D Microelectrode Arrays (3D MEAs) with "Edge-Wrapped" Metal Interconnects and 3D-Printed Assembly Rigs for Simultaneous Optical and Electrical Probing of Nerve-on-a-Chip® Constructs

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) ◽

10.1109/mems51782.2021.9375313 ◽

2021 ◽

Author(s):

Charles M. Didier ◽

Corey Rountree ◽

Julia Freitas Orrico ◽

Avra Kundu ◽

Nilab Azim ◽

...

Keyword(s):

Microelectrode Arrays ◽

3D Printed ◽

Fabrication And Characterization ◽

Metal Interconnects

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An Efficient Test Scheduling to Co-optimize Test Time and Peak Power for 3D ICs

2020 International Symposium on Devices, Circuits and Systems (ISDCS) ◽

10.1109/isdcs49393.2020.9263015 ◽

2020 ◽

Author(s):

Subhajit Chatterjee ◽

Surajit Kumar Roy ◽

Chandan Giri ◽

Hafizur Rahaman

Keyword(s):

Peak Power ◽

Test Time ◽

Test Scheduling ◽

3D Ics ◽

Efficient Test

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Non-specular scattering of carriers from surface defects in thin metal interconnects

Journal of Applied Physics ◽

10.1063/5.0026771 ◽

2020 ◽

Vol 128 (18) ◽

pp. 185103

Author(s):

Aniruddha Konar ◽

Prashant P. Shinde ◽

Shanthi Pandian ◽

Shashishekar P. Adiga ◽

K. Subramanya Mayya ◽

...

Keyword(s):

Surface Defects ◽

Thin Metal ◽

Specular Scattering ◽

Metal Interconnects

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