Modeling techniques for board level drop test for a wafer-level package

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607141 ◽

2008 ◽

Author(s):

Harpreet S. Dhiman ◽

Xuejun Fan ◽

Tiao Zhou

Keyword(s):

Drop Test ◽

Wafer Level ◽

Modeling Techniques ◽

Board Level ◽

Wafer Level Package

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Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2010.2042447 ◽

2010 ◽

Vol 33 (3) ◽

pp. 681-689 ◽

Author(s):

Chan-Yen Chou ◽

Tuan-Yu Hung ◽

Chao-Jen Huang ◽

Kuo-Ning Chiang

Keyword(s):

Failure Prediction ◽

Drop Test ◽

Empirical Equations ◽

Wafer Level ◽

Metal Trace ◽

Board Level ◽

Wafer Level Package

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Package & board level reliability study of 0.35mm fine pitch wafer level package

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046464 ◽

2017 ◽

Author(s):

Peng Sun ◽

Jun Liu ◽

Cheng Xu ◽

Liqiang Cao

Keyword(s):

Wafer Level ◽

Reliability Study ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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Board level reliability enhancements for wafer level package

2015 Annual Reliability and Maintainability Symposium (RAMS) ◽

10.1109/rams.2015.7105070 ◽

2015 ◽

Author(s):

John Qiao ◽

Wenwen He ◽

Kelly Yang ◽

Wei-Ting Kary Chien

Keyword(s):

Wafer Level ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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Reliability investigations of large die wafer level package (part II): Impact of solder ball composition, die thickness, and polymer passivition on board level reliability

2016 6th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2016.7764492 ◽

2016 ◽

Author(s):

Chien-An Hsieh ◽

Markus Jarn ◽

Yu-Chi Pai ◽

Yi-Liang Chen ◽

Bradford J. Factor ◽

...

Keyword(s):

Solder Ball ◽

Wafer Level ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability ◽

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Studying the Effect of Stackup Structure of Large Die Size Fan-In Wafer Level Package at 0.35 mm Pitch With Varying Ball Alloy to Enhance Board Level Reliability Performance

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.17 ◽

2016 ◽

Author(s):

Kuei Hsiao Kuo ◽

Jerry Chiang ◽

Kui Chang ◽

Jack Shu ◽

F. L. Chien ◽

...

Keyword(s):

Wafer Level ◽

Reliability Performance ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Microelectronics Reliability ◽

10.1016/j.microrel.2007.05.009 ◽

2008 ◽

Vol 48 (4) ◽

pp. 602-610 ◽

Author(s):

Xiaowu Zhang ◽

Vaidyanathan Kripesh ◽

T.C. Chai ◽

Teck Chun Tan ◽

D. Pinjala

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Wafer Level ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Board Level ◽

Wafer Level Package

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Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)

2018 IEEE International Reliability Physics Symposium (IRPS) ◽

10.1109/irps.2018.8353653 ◽

2018 ◽

Author(s):

Seongwon Jeong ◽

Jinseok Kim ◽

Ayoung Kim ◽

Byungwook Kim ◽

Moonsoo Lee ◽

...

Keyword(s):

Optimal Design ◽

Thermal Cycle ◽

Wafer Level ◽

Board Level ◽

Wafer Level Package

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A study of wafer level package board level reliability

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575728 ◽

2013 ◽

Author(s):

Steven Xu ◽

Beth Keser ◽

Christine Hau-Riege ◽

Steve Bezuk ◽

You-Wen Yau

Keyword(s):

Wafer Level ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159730 ◽

2015 ◽

Author(s):

Beth Keser ◽

Rey Alvarado ◽

Mark Schwarz ◽

Steve Bezuk

Keyword(s):

Wafer Level ◽

Ball Size ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF Transceivers

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00264 ◽

2020 ◽

Author(s):

Andreas Wolter ◽

Horst Baumeister ◽

Ceren Yeni ◽

Bemd Waidhas ◽

Jan Proschwitz ◽

...

Keyword(s):

Wafer Level ◽

Rf Transceivers ◽

Board Level ◽

Wafer Level Package ◽

Board Level Reliability

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