Package & board level reliability study of 0.35mm fine pitch wafer level package

2017 ◽  
Author(s):  
Peng Sun ◽  
Jun Liu ◽  
Cheng Xu ◽  
Liqiang Cao
Keyword(s):  
Wafer Level ◽  
Reliability Study ◽  
Fine Pitch ◽  
Board Level ◽  
Wafer Level Package ◽  
Board Level Reliability

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

2008 ◽  
Vol 48 (4) ◽  
pp. 602-610 ◽  
Author(s):  
Xiaowu Zhang ◽  
Vaidyanathan Kripesh ◽  
T.C. Chai ◽  
Teck Chun Tan ◽  
D. Pinjala
Keyword(s):  
Solder Joint ◽  
Reliability Analysis ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Fine Pitch ◽  
Board Level ◽  
Wafer Level Package

High Reliability Fine Pitch WLCSP for High Pin Count Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001894-001907
Author(s):  
David Lawhead ◽  
Ronnie Yazzie ◽  
Tony Curtis ◽  
Guy Burgess ◽  
Ted Tessier
Keyword(s):  
Silver Content ◽  
High Reliability ◽  
Electrical Performance ◽  
Thermal Testing ◽  
Automotive Electronics ◽  
Wafer Level ◽  
Industry Standard ◽  
Fine Pitch ◽  
Board Level ◽  
Board Level Reliability

Wafer Level Chip Scale Packages (WLCSP) have seen wider adoption in hand held as well as automotive electronics in recent years due to their unmatched form factor reductions and improved electrical performance. WLCSP's have gained popularity in high pin count IC's with tighter pitches and increased reliability requirements. Enhanced board level reliability is achieved by using solder spheres with higher silver content. Traditionally, automotive applications require an improvement in thermal cycling over WLCPS found in hand held applications. This paper will study the differences in solder alloy and include a comparison to under filled parts to meet these reliability requirements. This study shows characteristic life that exceeds the industry standard requirements for the drop and thermal testing reliability testing.

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