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0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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10.1109/ectc.2015.7159730
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2015
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Cited By ~ 6
Author(s):
Beth Keser
◽
Rey Alvarado
◽
Mark Schwarz
◽
Steve Bezuk
Keyword(s):
Wafer Level
◽
Ball Size
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
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Cited By
References
Package & board level reliability study of 0.35mm fine pitch wafer level package
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
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10.1109/icept.2017.8046464
◽
2017
◽
Cited By ~ 1
Author(s):
Peng Sun
◽
Jun Liu
◽
Cheng Xu
◽
Liqiang Cao
Keyword(s):
Wafer Level
◽
Reliability Study
◽
Fine Pitch
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
Board level reliability enhancements for wafer level package
2015 Annual Reliability and Maintainability Symposium (RAMS)
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10.1109/rams.2015.7105070
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2015
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Author(s):
John Qiao
◽
Wenwen He
◽
Kelly Yang
◽
Wei-Ting Kary Chien
Keyword(s):
Wafer Level
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
Reliability investigations of large die wafer level package (part II): Impact of solder ball composition, die thickness, and polymer passivition on board level reliability
2016 6th Electronic System-Integration Technology Conference (ESTC)
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10.1109/estc.2016.7764492
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2016
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Author(s):
Chien-An Hsieh
◽
Markus Jarn
◽
Yu-Chi Pai
◽
Yi-Liang Chen
◽
Bradford J. Factor
◽
...
Keyword(s):
Solder Ball
◽
Wafer Level
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
◽
Die Thickness
Download Full-text
Studying the Effect of Stackup Structure of Large Die Size Fan-In Wafer Level Package at 0.35 mm Pitch With Varying Ball Alloy to Enhance Board Level Reliability Performance
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2016.17
◽
2016
◽
Cited By ~ 2
Author(s):
Kuei Hsiao Kuo
◽
Jerry Chiang
◽
Kui Chang
◽
Jack Shu
◽
F. L. Chien
◽
...
Keyword(s):
Wafer Level
◽
Reliability Performance
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
A study of wafer level package board level reliability
2013 IEEE 63rd Electronic Components and Technology Conference
◽
10.1109/ectc.2013.6575728
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2013
◽
Cited By ~ 11
Author(s):
Steven Xu
◽
Beth Keser
◽
Christine Hau-Riege
◽
Steve Bezuk
◽
You-Wen Yau
Keyword(s):
Wafer Level
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF Transceivers
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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10.1109/ectc32862.2020.00264
◽
2020
◽
Author(s):
Andreas Wolter
◽
Horst Baumeister
◽
Ceren Yeni
◽
Bemd Waidhas
◽
Jan Proschwitz
◽
...
Keyword(s):
Wafer Level
◽
Rf Transceivers
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
Study of the Board Level Reliability Performance of a Large 0.3 mm Pitch Wafer Level Package
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00179
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2019
◽
Cited By ~ 2
Author(s):
Bernd Waidhas
◽
Jan Proschwitz
◽
Christoph Pietryga
◽
Thomas Wagner
◽
Beth Keser
Keyword(s):
Wafer Level
◽
Reliability Performance
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
The Comparative Study to Enhance Board Level Reliability Performance of Wafer Level Package At 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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10.1109/ectc.2017.29
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2017
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Author(s):
Kuei Hsiao Kuo
◽
Yi Sin Ting
◽
Chui Feng Weng
◽
Feng Lung Chien
◽
Katch Wan
◽
...
Keyword(s):
Comparative Study
◽
Wafer Level
◽
Reliability Performance
◽
The Comparative Study
◽
Board Level
◽
Wafer Level Package
◽
Board Level Reliability
Download Full-text
Modeling techniques for board level drop test for a wafer-level package
2008 International Conference on Electronic Packaging Technology & High Density Packaging
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10.1109/icept.2008.4607141
◽
2008
◽
Cited By ~ 23
Author(s):
Harpreet S. Dhiman
◽
Xuejun Fan
◽
Tiao Zhou
Keyword(s):
Drop Test
◽
Wafer Level
◽
Modeling Techniques
◽
Board Level
◽
Wafer Level Package
Download Full-text
Board Level Reliability Study of Next Generation Large Die Wafer Level Chip Scale Package Structures
2018 International Wafer Level Packaging Conference (IWLPC)
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10.23919/iwlpc.2018.8573297
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2018
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Author(s):
Timo Henttonen
◽
Paul Mescher
◽
Doug Scott
◽
Han Park
◽
YongJae Ko
◽
...
Keyword(s):
Next Generation
◽
Wafer Level
◽
Reliability Study
◽
Chip Scale Package
◽
Board Level
◽
Board Level Reliability
Download Full-text
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