A constitutive model for lead-free solders considering the damage effect at high strain rates

2011 ◽  
Author(s):  
Wang Xuming ◽  
Qin Fei ◽  
An Tong
Keyword(s):  
Constitutive Model ◽  
High Strain ◽  
Lead Free ◽  
Damage Effect ◽  
Strain Rates ◽  
High Strain Rates ◽  
Lead Free Solders

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

2009 ◽  
Vol 77 (1) ◽  
Author(s):  
Fei Qin ◽  
Tong An ◽  
Na Chen
Keyword(s):  
Strain Rate ◽  
Impact Analysis ◽  
Solder Joints ◽  
High Strain ◽  
Drop Impact ◽  
Lead Free ◽  
Strain Rates ◽  
High Strain Rates ◽  
Rate Dependent ◽  
Lead Free Solders

As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical behaviors of these lead-free solders at high strain rates. In this paper, mechanical properties of one lead-based solder, Sn37Pb, and two lead-free solders, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated at strain rates that ranged from 600 s−1 to 2200 s−1 by the split Hopkinson pressure and tensile bar technique. At high strain rates, tensile strengths of lead-free solders are about 1.5 times greater than that of the Sn37Pb solder, and also their ductility are significantly greater than that of the Sn37Pb. Based on the experimental data, strain rate dependent Johnson–Cook models for the three solders were derived and employed to predict behaviors of solder joints in a board level electronic package subjected to standard drop impact load. Results indicate that for the drop impact analysis of lead-free solder joints, the strain rate effect must be considered and rate-dependent material models of lead-free solders are indispensable.

Stress–Strain Behavior of SAC305 at High Strain Rates

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Pradeep Lall ◽  
Sandeep Shantaram ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Constitutive Model ◽  
Solder Alloy ◽  
High Strain ◽  
Image Correlation ◽  
Lead Free ◽  
Constitutive Behavior ◽  
Strain Rates ◽  
Mechanical Shock ◽  
High Strain Rates ◽  
Test Technique

Electronic products are subjected to high G-levels during mechanical shock and vibration. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. The second-level interconnects may be experience high strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper alloys is Sn3Ag0.5Cu. The high strain rate properties of lead-free solder alloys are scarce. Typical material tests systems are not well suited for measurement of high strain rates typical of mechanical shock. Previously, high strain rates techniques such as the split Hopkinson pressure bar (SHPB) can be used for strain rates of 1000 s−1. However, measurement of materials at strain rates of 1–100 s−1 which are typical of mechanical shock is difficult to address. In this paper, a new test-technique developed by the authors has been presented for measurement of material constitutive behavior. The instrument enables attaining strain rates in the neighborhood of 1–100 s−1. High-speed cameras operating at 300,000 fps have been used in conjunction with digital image correlation (DIC) for the measurement of full-field strain during the test. Constancy of crosshead velocity has been demonstrated during the test from the unloaded state to the specimen failure. Solder alloy constitutive behavior has been measured for SAC305 solder. Constitutive model has been fit to the material data. Samples have been tested at various time under thermal aging at 25 °C and 125 °C. The constitutive model has been embedded into an explicit finite element framework for the purpose of life-prediction of lead-free interconnects. Test assemblies has been fabricated and tested under Joint Electron Device Engineering Council (JEDEC) JESD22-B111 specified condition for mechanical shock. Model predictions have been correlated with experimental data.

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Fei Qin ◽  
Tong An ◽  
Na Chen ◽  
Jie Bai
Keyword(s):  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
High Strain Rates ◽  
Reliability Design ◽  
Split Hopkinson Tensile Bar ◽  
Rate Dependent ◽  
Before And After ◽  
Split Hopkinson ◽  
Lead Free Solders

Behavior of solder joints in microelectronic packages is crucial to the drop impact reliability design of mobile electronic products. In this paper, tensile behaviors of Sn37Pb, Sn3.5Ag, and Sn3.0Ag0.5Cu at strain rates of 600 s−1, 1200 s−1, and 1800 s−1 were investigated using the split Hopkinson tensile bar experimental technique. Stress-strain curves of the three solders were obtained, and microstructure and fractography of the specimens before and after the tests were examined and presented. The experimental results show that the lead-free solders are strongly strain rate dependent: Their tensile strength, percent elongation, and percent reduction in area are much greater than those properties of the lead-containing solder at high strain rates.

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

2020 ◽  
Vol 143 (2) ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Constitutive Model ◽  
Thermal Aging ◽  
High Strain ◽  
Lead Free ◽  
Constitutive Behavior ◽  
Strain Rates ◽  
Lead Free Solder ◽  
High Strain Rates ◽  
Shock Event ◽  
Free Solder

Abstract Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and handling, which can contribute to the failures of electronic devices. Temperatures in these applications can exceed 200 °C, which is close to melting point for SnAgCu (SAC) alloys. Prior studies at low strain rates have shown property evolution even under moderate exposure to high temperature. In this paper, the evolution of Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead-free solder alloys at high strain rates has been investigated induced under sustained periods of thermal aging. The thermal aged lead-free SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated temperatures of (25 °C–200 °C). The SAC lead-free solder samples were subjected to isothermal aging at 50 °C up to 1-year before testing. To describe the material constitutive behavior, the Anand Viscoplastic model has been used. The effect of thermal aging on Anand parameters also has been investigated. In order to verify the accuracy of the model, the computed Anand parameters have been used to simulate the uni-axial tensile test. The material constitutive behavior has been implemented in a finite element framework to simulate the drop events using the Anand constitutive model and determine the plastic work per shock event. The plastic work per shock event is a measure of the damage progression in the solder interconnects. The constitutive model has been used to simulate the shock event of a ball-grid array package on printed circuit board assembly.

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Thermal Aging ◽  
High Strain ◽  
Lead Free ◽  
Uniaxial Tensile ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
High Strain Rates ◽  
Free Solder ◽  
Sac Solder

Abstract Electronic components in downhole oil drilling and gas industry applications, automotive and avionics may exposed to high temperatures (> 150°C) and high strain rates (1–100 per sec) during storage, operation and handling which can contribute to the failures of electronics devices. Temperatures in these applications can exceed 200°C, which is closed to melting point for SAC alloys. The microstructure for lead free solder alloys constantly evolves when subjected to thermal aging for sustained periods with accompanying degradation in mechanical properties of solder alloys. In this paper, evolution of microstructure and Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead free solder alloys at high strain rates has been investigated induced due to thermal aging. The microstructure of the SAC solder is studied using scanning electron microscopy (SEM) for different strain rate and elevating temperature. The thermal aged leadfree SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated temperatures of (25°C–200°C). The SAC leadfree solder samples were subjected to isothermal aging at 50°C up to 1-year before testing. To describe the material constitutive behavior, Anand Viscoplastic model has been used. Effect of thermal aging on Anand parameters has been investigated. In order to verify the accuracy of the model, the computed Anand parameters have been used to simulate the uniaxial tensile test. FEA based method has been used to simulate the drop events using Anand constitutive model. Hysteresis loop and Plastic work density has been computed from FEA.

Sign in / Sign up

Export Citation Format

Share Document