The finite element simulation and nanoindentation methods for the study of mechanical behavior of lead-free solder joints

2015 ◽  
Author(s):  
Lifeng Wang ◽  
Jia Zhou ◽  
Yingjie Liu ◽  
Qi Ge ◽  
Yuanjian Zhang ◽  
...  
Keyword(s):  
Finite Element ◽  
Mechanical Behavior ◽  
Finite Element Simulation ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Element Simulation ◽  
Free Solder

Application of Finite Element Method in Optimal Design of Flip-Chip Package

2011 ◽  
Vol 264-265 ◽  
pp. 1660-1665
Author(s):  
Yong Cheng Lin ◽  
Yu Chi Xia
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

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