Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

2016 ◽  
Vol 685 ◽  
pp. 983-991 ◽  
Author(s):  
Z.L. Li ◽  
G.Y. Li ◽  
B. Li ◽  
L.X. Cheng ◽  
J.H. Huang ◽  
...  
Keyword(s):  
Size Effect ◽  
Solder Joints ◽  
Reflow Process ◽  
Micro Scale

scholarly journals Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process

2021 ◽  
Vol 204 ◽  
pp. 109671
Author(s):  
Yuanyuan Qiao ◽  
Xiaoying Liu ◽  
Haitao Ma ◽  
Ning Zhao
Keyword(s):  
Solder Joints ◽  
Reflow Process

A SIZE EFFECT STUDY ON THE SPLITTING CRACK INITIATION AND PROPAGATION IN OFF-AXIS LAYERS OF COMPOSITE LAMINATES

2021 ◽  
Author(s):  
YAO QIAO ◽  
QIWEI ZHANG ◽  
TROY NAKAGAWA ◽  
MARCO SALVIATO
Keyword(s):  
Crack Initiation ◽  
Size Effect ◽  
Fiber Reinforced Polymers ◽  
Structural Behavior ◽  
Crack Initiation And Propagation ◽  
Damage Mechanisms ◽  
Micro Scale ◽  
Morphological Studies ◽  
Initiation And Propagation ◽  
Macro Scale

This work proposes an investigation on size effects in micro-scale splitting crack initiation and propagation and their consequences on the macro-scale structural behavior carbon-fiber reinforced polymers under transverse tension. Towards this goal, size effect tests were experimentally conducted on both notch-free [90]n composites and specimens with different notch types under three-point bending. The mechanical tests were followed by morphological studies to identify the micro-scale damage mechanisms and their evolution. The results clearly show that splitting crack initiation in the transverse direction of composites not only happens at the fiber/matrix interface but also in the matrix. Moreover, the subsequent development of these damage mechanisms can depend on the structure size. This interesting phenomenon inherently leads to size-dependent structural behavior which can be described through Baznt’s Size Effect Laws. This study on the splitting crack initiation and propagation can provide unprecedented information for the calibration and validation of micromechanical models for the damage behavior of fiber composites at the microscale.

scholarly journals Size effect on interface reaction of Sn–xCu/Cu solder joints during multiple reflows

2019 ◽  
Vol 30 (5) ◽  
pp. 4359-4369 ◽  
Author(s):  
Ru Huang ◽  
Haoran Ma ◽  
Shengyan Shang ◽  
Anil Kunwar ◽  
Yunpeng Wang ◽  
...  
Keyword(s):  
Size Effect ◽  
Solder Joints ◽  
Interface Reaction

Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

1999 ◽  
Vol 124 (1) ◽  
pp. 37-44 ◽  
Author(s):  
Wen-Hwa Chen ◽  
Kuo-Ning Chiang ◽  
Shu-Ru Lin
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Reflow Process ◽  
Surface Evolver ◽  
Restoring Force ◽  
Solder Mask ◽  
The Difference ◽  
Design Factors ◽  
Joint Volume ◽  
Liquid Formation

This study presents an efficient method to accurately predict solder joint geometry after a reflow process. The proposed method can be utilized for Solder Mask Defined (SMD), Non-Solder Mask Defined (NSMD), or C4 type solder joints. The reflow process involves several design factors capable of influencing the final shape of the molten solder joint, such as solder joint volume, restoring force, surface tension, contact angle, pad thickness, and pad size. These factors are all considered in the calculations. The computed results are compared with those using the Surface Evolver program and also with available numerical/experimental results. Their excellent agreement shows that the method developed herein can be practically applied to predict the reflow shape of SMD/NSMD solder joints. The difference between SMD and NSMD is also examined in detail. Results in this study provide designers with a fundamental guideline for accurately predicting the liquid formation of solder joints during the reflow process.

scholarly journals Size effect in micro-scale cantilever beam bending

2011 ◽  
Vol 219 (3-4) ◽  
pp. 291-307 ◽  
Author(s):  
S. H. Chen ◽  
B. Feng
Keyword(s):  
Size Effect ◽  
Cantilever Beam ◽  
Micro Scale ◽  
Beam Bending

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

2016 ◽  
Vol 28 (2) ◽  
pp. 41-62 ◽  
Author(s):  
Chun Sean Lau ◽  
C.Y. Khor ◽  
D. Soares ◽  
J.C. Teixeira ◽  
M.Z. Abdullah
Keyword(s):  
Solder Joints ◽  
Simulation Modelling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Process ◽  
Reflow Soldering ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Free Solder

Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

scholarly journals Characterization of the Fluidity of the Ultrasonic Plasticized Polymer Melt by Spiral Flow Testing under Micro-Scale

Polymers ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 357 ◽  
Author(s):  
Bingyan Jiang ◽  
Yang Zou ◽  
Tao Liu ◽  
Wangqing Wu
Keyword(s):  
Size Effect ◽  
Amorphous Polymer ◽  
Polymer Melt ◽  
Mold Temperature ◽  
Polyamide 66 ◽  
Spiral Flow ◽  
Crystalline Polymers ◽  
Micro Scale ◽  
Flow Length ◽  
And Control

The fluidity of a molten polymer plasticized by ultrasonic vibration was characterized by spiral flow testing based on an Archimedes spiral mold with microchannels. Mold inserts with various channel depths from 250 to 750 µm were designed and fabricated to represent the size effect under micro-scale. The effect of ultrasonic plasticizing parameters and the mold temperature on the flow length was studied to determine the rheological nature of polymers and control parameters. The results showed that the flow length decreased with reduced channel depth due to the size effect. By increasing ultrasonic amplitude, ultrasonic action time, plasticizing pressure, and mold temperature, the flow length could be significantly increased for both the amorphous polymer polymethyl methacrylate (PMMA) and the semi-crystalline polymers polypropylene (PP) and polyamide 66 (PA66). The enhanced fluidity of the ultrasonic plasticized polymer melt could be attributed to the significantly reduced shear viscosity.

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