Build-in reliability analysis for circuit design in the nanometer technology era

Author(s):  
Zhihong Liu ◽  
Weiquan Zhang ◽  
Fuchen Mu
1983 ◽  
Vol 10 (2-3) ◽  
pp. 63-66 ◽  
Author(s):  
Sedat Širbegovic ◽  
Milan Mazalica ◽  
Ratko Krcmar

The paper includes temperature measurement results on hybrid microelectronic circuit surfaces carried out by infrared microscope with special attention to critical temperatures (hot spots) which may require hybrid microelectronic circuit redesign. Critical component reliability analysis, as well as the need for replacement with more reliable components is considered. The principle for hybrid microelectronic design verification suggested.The paper is the result of longterm efforts at the Rudi Čajavec Factory in Banja Luka, where we have been investigating the possibilities for very reliable hybrid microelectronic circuit design.


1998 ◽  
Vol 45 (10) ◽  
pp. 2254-2257 ◽  
Author(s):  
S.P. Riege ◽  
C.V. Thompson ◽  
J.J. Clement

VLSI Design ◽  
2014 ◽  
Vol 2014 ◽  
pp. 1-12 ◽  
Author(s):  
Ran Xiao ◽  
Chunhong Chen

Circuit reliability has become a growing concern in today’s nanoelectronics, which motivates strong research interest over the years in reliability analysis and reliability-oriented circuit design. While quite a few approaches for circuit reliability analysis have been reported, there is a lack of comparative studies on their pros and cons in terms of both accuracy and efficiency. This paper provides an overview of some typical methods for reliability analysis with focus on gate-level circuits, large or small, with or without reconvergent fanouts. It is intended to help the readers gain an insight into the reliability issues, and their complexity as well as optional solutions. Understanding the reliability analysis is also a first step towards advanced circuit designs for improved reliability in the future research.


2009 ◽  
Author(s):  
Ronald Laurids Boring ◽  
Johanna Oxstrand ◽  
Michael Hildebrandt

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