Crystal quality problems of epitaxial layer growth on indium phosphide

Author(s):  
A.M. Huber ◽  
C. Grattepain
2006 ◽  
Vol 527-529 ◽  
pp. 179-182 ◽  
Author(s):  
Stefano Leone ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Abbondanza ◽  
F. Portuese ◽  
...  

4H-SiC epitaxial layers have been grown using trichlorosilane (TCS) as the silicon precursor source together with ethylene as the carbon precursor source. A higher C/Si ratio is necessary compared with the silane/ethylene system. This ratio has to be reduced especially at higher Si/H2 ratio because the step-bunching effect occurs. From the comparison with the process that uses silane as the silicon precursor, a 15% higher growth rate has been found using TCS (trichlorosilane) at the same Si/H2 ratio. Furthermore, in the TCS process, the presence of chlorine, that reduces the possibility of silicon droplet formation, allows to use a high Si/H2 ratio and then to reach high growth rates (16 *m/h). The obtained results on the growth rates, the surface roughness and the crystal quality are very promising.


1979 ◽  
Vol 54 (2) ◽  
pp. 463-469 ◽  
Author(s):  
L. N. Aeksandrov ◽  
A. S. Ltovich ◽  
E. D. Blorusets

2014 ◽  
Vol 778-780 ◽  
pp. 113-116 ◽  
Author(s):  
Albert A. Burk ◽  
D. Tsvetkov ◽  
Michael J. O'Loughlin ◽  
S. Ustin ◽  
L. Garrett ◽  
...  

Latest results are presented for SiC-epitaxial growths employing a novel 6x150-mm/10x100-mm Warm-Wall Planetary Vapor-Phase Epitaxial (VPE) Reactor. The increased throughput offered by this reactor and 150-mm diameter wafers, is intended to reduce the cost per unit area for SiC epitaxial layers, increasing the market penetration of already successful commercial SiC Schottky and MOSFET devices [1]. Increased growth rates of 30-40 micron/hr and short <2 hr fixed-cycle times (including rapid heat-up and cool-down ramps), while maintaining desirable epitaxial layer quality were achieved. Increased quantities of 150-mm epitaxial wafers now allow statistical analysis of their epitaxial layer properties. Specular epitaxial layer morphology was obtained, with morphological defect densities <0.4 cm-2, consistent with projected 5x5 mm die yields averaging 93% for Si-face epitaxial layers between 10 and 30 microns thick. Intrawafer thickness and doping uniformity are good, averaging 1.7% and 5.1% respectively. Wafer-to-wafer doping variation has also been significantly reduced from ~12 [5] to <3% s/mean. Initial results for C-face growths show excellent morphology (97%) but poor doping uniformity (~16%). Wafer shape is relatively unchanged by epitaxial growth consistent with good epitaxial temperature uniformity.


1991 ◽  
Vol 190 (1-2) ◽  
pp. 43-45 ◽  
Author(s):  
M. Yoshimoto ◽  
H. Nagata ◽  
S. Gonda ◽  
J.P. Gong ◽  
H. Ohkubo ◽  
...  

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