In this contribution, fundamental design considerations for a novel metallization technique to realize millimeter-wave microstrip structures are presented. This hot embossing technology is a fast and economic process originating from the production of three-dimensional molded interconnect devices. Conductive structures are coated onto plastic parts or plastic foils using a heated stamp. This approach shows high potential and therefore will be investigated for the fabrication of low-cost printed antennas at millimeter-wave frequencies. The focus of this contribution is on design guidelines considering process parameters and interactions with substrate and copper foil characteristics derived from the fabrication and measurement of single microstrip patch antenna prototypes for radar applications in the industrial, scientific and medical (ISM) band at 24 GHz. Far-reaching potential lies in the utilization of the three-dimensional manufacturing technology for the construction of conformal integrated antenna systems based on the thermoforming capabilities of polymer substrates.
MILLIMETER WAVE CAVITY BACKED MICROSTRIP ANTENNA ARRAY FOR 79 GHZ RADAR APPLICATIONS
