A 45nm High Performance Bulk Logic Platform Technology (CMOS6) using Ultra High NA(1.07) Immersion Lithography with Hybrid Dual-Damascene Structure and Porous Low-k BEOL

2006 ◽  
Author(s):  
H. Nii ◽  
T. Sanuki ◽  
Y. Okayama ◽  
K. Ota ◽  
T. Iwamoto ◽  
...  
Keyword(s):  
High Performance ◽  
Immersion Lithography ◽  
Dual Damascene ◽  
Platform Technology ◽  
Low K

High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process

2009 ◽  
Vol 156 (7) ◽  
pp. H548 ◽  
Author(s):  
Yukiteru Matsui ◽  
Satoko Seta ◽  
Masako Kinoshita ◽  
Yoshikuni Tateyama ◽  
Atsushi Shigeta ◽  
...  
Keyword(s):  
High Performance ◽  
Dual Damascene ◽  
Damascene Process ◽  
Planarization Process ◽  
Low K

High-performance intrinsic low-k polymer via the synergistic effect of its three units: adamantyl, perfluorocyclobutylidene and benzocyclobutene

RSC Advances ◽  
2016 ◽  
Vol 6 (73) ◽  
pp. 68560-68567 ◽  
Author(s):  
Lingqiang Kong ◽  
Tianke Qi ◽  
Zhidong Ren ◽  
Yunxia Jin ◽  
Yan Li ◽  
...  
Keyword(s):  
Synergistic Effect ◽  
High Performance ◽  
Low K

Intrinsic highly cross-linked low-k benzocyclobutene polymer functionalized with adamantyl and perfluorocyclobutylidene.

Formation of highly reliable Cu/low-k interconnects by using CVD Co barrier in dual damascene structures

2011 ◽  
Author(s):  
Hye Kyung Jung ◽  
Hyun-Bae Lee ◽  
Matsuda Tsukasa ◽  
Eunji Jung ◽  
Jong-Ho Yun ◽  
...  
Keyword(s):  
Dual Damascene ◽  
Low K
Sign in / Sign up

Export Citation Format

Share Document