Fabrication of a micro-biochemical reactor with thick thermal isolation layer and integrated Pt heater/sensor in the micro-well

2004 ◽  
Author(s):  
Hoon-Sung Choi ◽  
Chang-Taeg Seo ◽  
Young-Min Kim ◽  
Jang-Kyoo Shin ◽  
Pyung Choi ◽  
...  
Keyword(s):  
Thermal Isolation ◽  
Isolation Layer ◽  
Biochemical Reactor

Fabrication of a Microbiochemical Reactor with Thick Thermal Isolation Layer and Integrated Pt Heater/Sensor in the Microwell

2004 ◽  
Vol 43 (6B) ◽  
pp. 3868-3871 ◽  
Author(s):  
Hoon-Sung Choi ◽  
Chang-Taeg Seo ◽  
Duk-Soo Eun ◽  
Jang-Kyoo Shin ◽  
Pyung Choi ◽  
...  
Keyword(s):  
Thermal Isolation ◽  
Isolation Layer

A Uncooled α-Si Infrared Detector Using Polyimide as Thermal Isolation Layer

2009 ◽  
Vol 60-61 ◽  
pp. 371-374
Author(s):  
Hua Jun Fang ◽  
Xing Ming Liu ◽  
Li Tian Liu
Keyword(s):  
Large Scale ◽  
Lower Cost ◽  
Infrared Detector ◽  
Focal Plane Arrays ◽  
Ir Absorption ◽  
Temperature Coefficient Of Resistance ◽  
Ir Detectors ◽  
Thermal Isolation ◽  
Isolation Layer ◽  
Measurement Results

a new structure of the uncooled amorphous silicon (α-Si) infrared detector has been fabricated and characterized. The structure with thermal isolation and infrared absorption based on polyimide (PI) and bottom metal reflective layer is put forward. The fabrication process of the IR detectors is described. The temperature coefficient of resistance (TCR) of α-Si resistance has been investigated. The measurements show that the TCR is up to -2.8%. The detectivity of 1.7×108 cmHz1/2W-1 is achieved with chopping frequency of 30Hz at a bias voltage of 5V. Measurement results indicate that the polyimide layer exhibits excellent thermal isolating characteristics and the unique sandwich IR absorption structure is beneficial to the enhancement of detectivity. Compared with other techniques, the IR detectors using PI as thermal isolation layer are not only with simpler process, lower cost and higher yield, but also suitable for the application of large-scale uncooled infrared focal plane arrays (IRFPA).

Characterization of mesoporous silica thin films for application to thermal isolation layer

2018 ◽  
Vol 660 ◽  
pp. 715-719 ◽  
Author(s):  
Junmyung Lee ◽  
Jihun Kim ◽  
Byung Jun Lee ◽  
Jongchan Lee ◽  
Hyun Woo Lee ◽  
...  
Keyword(s):  
Thin Films ◽  
Mesoporous Silica ◽  
Thermal Isolation ◽  
Isolation Layer ◽  
Silica Thin Films

Improvement of uncooled infrared imaging detector by using mesoporous silica as a thermal isolation layer

2008 ◽  
Vol 34 (4) ◽  
pp. 833-836 ◽  
Author(s):  
Sun Gyu Choi ◽  
Tae-Jung Ha ◽  
Byoung-Gon Yu ◽  
Seung Pil Jaung ◽  
Ohmyoung Kwon ◽  
...  
Keyword(s):  
Mesoporous Silica ◽  
Infrared Imaging ◽  
Thermal Isolation ◽  
Isolation Layer ◽  
Imaging Detector ◽  
Uncooled Infrared Imaging

Application of mesoporous TiO2 as a thermal isolation layer for infrared sensors

2007 ◽  
Vol 516 (2-4) ◽  
pp. 212-215 ◽  
Author(s):  
Sun Gyu Choi ◽  
Tae-Jung Ha ◽  
Byoung-Gon Yu ◽  
Sangwoo Shin ◽  
Hyung Hee Cho ◽  
...  
Keyword(s):  
Mesoporous Tio2 ◽  
Infrared Sensors ◽  
Thermal Isolation ◽  
Isolation Layer

scholarly journals Study on thermal conductivity of porous silicon thermal isolation layer based on micro-structure mathematical model

2010 ◽  
Vol 59 (12) ◽  
pp. 8794
Author(s):  
Xu Lu-Jia ◽  
Hu Ming ◽  
Yang Hai-Bo ◽  
Yang Meng-Lin ◽  
Zhang Jie
Keyword(s):  
Thermal Conductivity ◽  
Mathematical Model ◽  
Porous Silicon ◽  
Micro Structure ◽  
Thermal Isolation ◽  
Isolation Layer

Design and Simulation of Thermopile Sensor Technology Based on Porous Silicon

2015 ◽  
Vol 741 ◽  
pp. 289-293
Author(s):  
Yan Wei Dou ◽  
Cheng Jun Qiu ◽  
Bo Zang ◽  
Jing Xuan Wang ◽  
Xiao Dong Zhang
Keyword(s):  
Mechanical Property ◽  
Porous Silicon ◽  
Polycrystalline Silicon ◽  
Sensor Technology ◽  
Thermal Isolation ◽  
Thermoelectromotive Force ◽  
Software Analysis ◽  
Ansys Simulation ◽  
Isolation Layer ◽  
Thermopile Sensor

Thermopile sensor using porous silicon (PS) as thermal isolation layer was designed. Thermal stability and mechanical property of sensor were simulated by IntelliSuite CAD software. Analysis results showed stress and temperature distribution of PS layer. Ansys simulation indicated that thermocouple’s thermoelectromotive force was decided by its material composition. If thermocouple was composed of polycrystalline silicon/aluminum, its thermoelectromotive force would reach 256.8 μV/K.

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