Pure palladium in ENEPIG surface finishes — Physical properties of the Pd deposition and their influence on soldering and wire bonding

2010 ◽  
Author(s):  
Bill Kao ◽  
Mustafa Oezkoek ◽  
Hugh Roberts
Keyword(s):  
Physical Properties ◽  
Wire Bonding ◽  
Surface Finishes ◽  
Pure Palladium

Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire Bonding

2010 ◽  
Vol 2010 (1) ◽  
pp. 000675-000681 ◽  
Author(s):  
Mustafa Oezkoek ◽  
Hugh Roberts ◽  
Joe McGurran
Keyword(s):  
Physical Properties ◽  
Electroless Nickel ◽  
Gold Wire ◽  
Wire Bonding ◽  
Electroless Nickel Immersion Gold ◽  
Surface Finishes ◽  
Gold Thickness ◽  
Palladium Surface ◽  
Joint Integrity ◽  
Pure Palladium

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows the benefits of using a pure palladium layer in ENEPIG and ENEP (Electroless Nickel / Electroless Palladium) surface finishes in terms of physical properties and in terms of gold wire bonding and solder joint integrity.

Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

1999 ◽  
Vol 22 (1) ◽  
pp. 7-15 ◽  
Author(s):  
R.W. Johnson ◽  
M.J. Palmer ◽  
M.J. Bozack ◽  
T. Isaacs-Smith
Keyword(s):  
Gold Wire ◽  
Wire Bonding ◽  
Surface Finishes ◽  
Palladium Surface

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

VASCO MC

Alloy Digest ◽  
1964 ◽  
Vol 13 (2) ◽  
Keyword(s):  
Physical Properties ◽  
Tensile Properties ◽  
High Surface ◽  
Heat Treating ◽  
Vanadium Alloys ◽  
Medium Carbon ◽  
Surface Finishes ◽  
Steel Corporation

Abstract VASCO-MC is a medium carbon, chromium, molybdenum mold and cavity steel recommended for molds where good machinability and high surface finishes are desired. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on forming, heat treating, machining, and joining. Filing Code: TS-143. Producer or source: Vanadium Alloys Steel Corporation.

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000257-000260
Author(s):  
Maren Bruder ◽  
Guenter Heinz ◽  
Mustafa Oezkoek
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Economic Benefits ◽  
Wire Bonding ◽  
Gold Layer ◽  
Ceramic Substrates ◽  
Main Layer ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Assembly Technology

Surface finishes for ceramic electronics are an important feature. . The suitable surface finish allows the appropriate assembly technology to be performed on the ceramic substrate. The paper will present the possible surface finish options for ceramic substrates and include the advantages and challenges of each surface finish. Furthermore it will show the potential of a new surface finish called “Direct EPAG”. The demand for these new finishes is based on needs for new assembly technologies like copper wire bonding and for high frequency applications. Furthermore Nickel which the main layer of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element due to several disadvantages. All these concerns are supporting the introduction of a new surface finish called “direct EPAG” (Electroless Palladium, Autocatalytic Gold) finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint. In addition, the mentioned technological drawbacks of nickel based finishes could be solved by applying a revolutionary surface finish: “direct palladium with an optional direct gold layer on copper”. The direct deposition of palladium on copper with an optional gold layer does have a number of technological, environmental and economic benefits. The suggested paper will describe and discuss the advantages and challenges using this new surface finish. It will also exhibit the results of various soldering and wire bond tests on the EPAG finish.

scholarly journals Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials

2013 ◽  
Vol 2013 (1) ◽  
pp. 000312-000317 ◽  
Author(s):  
A. Rezvani ◽  
M. Mayer ◽  
I. Qin ◽  
J. Brunner ◽  
Bob Chylak
Keyword(s):  
Process Parameters ◽  
Surface Finish ◽  
Cost Reduction ◽  
Wire Bonding ◽  
Process Window ◽  
Capillary Surface ◽  
Bond Force ◽  
Short Tail ◽  
Surface Finishes ◽  
The Wire

Cost reduction is the main driver in the recent transition to Cu wire bonding from predominate Au wire bonding. Other cost reduction in packaging comes from new developments in substrates and lead frames, for example, Pre-Plated Frames (PPF) and uPPF for QFP and QFN reduce the plating and material cost. However, 2nd bonds (stitch bonds) can be more challenging on some of the new leadframe types due to the rough surface finish and thin plating thickness. Pd-coated Cu (PCC) wire has been recently introduced to improve the wire bonding process with bare Cu wire, mainly to improve reliability and enhance the stitch bond process. More fundamental studies are required to understand the influences of bonding parameters and bonding tools to improve stitch bondability. The stitch bond process of 0.7 mil diameter PCC wire on Au/Ni/Pd-plated quad flat-no lead (QFN) PPF substrate is investigated in this study. Two capillaries with the same geometry but different surface finishes are used to investigate the effect of capillary surface finish on the stitch bond process. The two capillary types are a polished finish type which is commonly used for Au wire bonding, and a granular finish capillary that has a much rougher surface finish. Process window between no stick on lead (NSOL) and short tail is compared. The effect of process parameters including bond force and table scrub amplitude is studied. The process window test results revealed that the granular capillary has larger process window and a lower chance of short tail occurrence. It has been shown that a higher scrub amplitude increases the chance of successful stitch bond formation. To further compare the capillary surface finishes, 3 sets of parameter settings with different bond force and scrub amplitude are tested. For all three parameter sets tested, the granular capillary showed better quality in bond strength. The granular capillary resulted in higher stitch pull strength compared to the polished type. A finite element model (FEM) of the process was developed to better understand the experimental observations. The amount of surface expansion (plastic deformation) of the wire at the wire and substrate interface was extracted from the model and attributed to the degree of adhesion (bonding). The model was used to confirm the experimental observation of adhesion (bonding) with different surface finish.

POLMAX

Alloy Digest ◽  
2005 ◽  
Vol 54 (2) ◽  
Keyword(s):  
Wear Resistance ◽  
Corrosion Resistance ◽  
North America ◽  
Physical Properties ◽  
Surface Treatment ◽  
Heat Treating ◽  
Corrosion Resistant ◽  
Extreme Surface ◽  
Good Corrosion Resistance ◽  
Surface Finishes

Abstract Polmax was developed to be both highly polishable and corrosion resistant for extreme surface finishes such as in lens molds. Polmax has excellent polishability, good corrosion resistance, good wear resistance, good machinability, and good stability in hardening. It is used for applications where extreme surface finishes are required, such as lens molds, molds for compact discs and memory discs, and molds for med-ical applications. This datasheet provides information on composition, physical properties, microstructure, elasticity, and tensile properties. It also includes information on corrosion resistance and surface qualities as well as heat treating and surface treatment. Filing Code: SS-918. Producer or source: Böhler-Uddeholm North America.

Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes

2011 ◽  
Vol 2011 (1) ◽  
pp. 000566-000570
Author(s):  
Mustafa Oezkoek ◽  
Horst Clauberg ◽  
Hugh Roberts
Keyword(s):  
Surface Finish ◽  
Thermal Aging ◽  
Copper Wire ◽  
Pure Copper ◽  
Wire Bonding ◽  
Throughput Optimization ◽  
Wire Bond ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Pure Cu

During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold applications. The most commonly used copper wire is 20um in diameter and 18um copper wire is already being used in mass production. Evaluations with even finer wire are underway. Although some technical challenges remain, many years of research have now resolved most of the problems associated with copper wire bonding and attention is beginning to shift from merely ensuring reliable manufacturing processes to optimizing processes for efficiency and throughput. The most advanced wire bonders now have pre-configured processes specifically designed for copper. In addition to throughput optimization, further cost reductions are being sought. Among these is the desire to eliminate the high-cost gold not just from the wire, but also from the substrate. On the substrate side the electronics packaging industry still works with electrolytic nickel / electrolytic (soft) gold (Ni/Au) for copper wire bond applications. This surface finish works with copper wire bonding but includes some disadvantages, such as:- Thick expensive Au layers of 0.1 to 0.4μm- Electrically connected pads (bussing for the plating) which requires added space on the substrate.- Pd-coated copper wire often delivers better results on gold covered finishes, but is two to three times more expensive as pure copper wire Furthermore electrolytic Ni/Au was not chosen for Cu wire bonding as a result of in-depth investigations for the most effective surface finish. The selection was made because it was the surface finish with the highest distribution in the market for wire bond packages. This paper is offering the results of a two company joint work regarding alternative copper wire bondable surface finishes. The result of the project is separated in 2 papers/publications. The first publication [1] presents the investigations with Cu wire bond pull forces and process windows of 23 different surface finish variations. The main aim was to identify alternative surface finishes for copper wire bonding. Within this study the surface finishes ENEP (Electroless Nickel/Electroless Palladium) and “Direct Electroless pure Pd on copper” (pure EP finish) was identified as copper wire bondable finishes with the pure Cu wire. The second part of the evaluation summarizes an in-depth study of copper wire bonding tests after thermal aging with ENEP and the pure EP surface finish using the pure copper wire. The results of this investigation does include results with pull forces after thermal aging and an IMC Investigation with FIB Pictures of the copper wire/surface finish connection in order to evaluate the reliability of such an interconnection.

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